JPH01135737U - - Google Patents
Info
- Publication number
- JPH01135737U JPH01135737U JP3151588U JP3151588U JPH01135737U JP H01135737 U JPH01135737 U JP H01135737U JP 3151588 U JP3151588 U JP 3151588U JP 3151588 U JP3151588 U JP 3151588U JP H01135737 U JPH01135737 U JP H01135737U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- hole
- electrode
- electronic component
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Wire Bonding (AREA)
Description
第１図ａ，ｂ，ｃ，ｄは本考案の一実施例にお
けるリードフレームの接合手順を示す断面図、第
２図は同上のリードフレームの接合部分を示す平
面図、第３図ａ，ｂは従来例の説明図である。
１……リードフレーム、１ａ……接合部分、２
……透孔、３……溶加材、４……電子部品素子、
５……電極。
Figures 1 a, b, c, and d are cross-sectional views showing the lead frame joining procedure in an embodiment of the present invention, Figure 2 is a plan view showing the joint portion of the same lead frame, and Figures 3 a, b. is an explanatory diagram of a conventional example. 1...Lead frame, 1a...Joint part, 2
...Through hole, 3...Filler material, 4...Electronic component element,
5... Electrode.
Claims (1)
の透孔内にはんだやろう材等の溶加材を浸入させ
るようにしてリードフレームを電子部品素子の電
極にろう接して成るリードフレームの接合構造。 A lead frame joint structure in which a through hole is drilled in the joint portion of the lead frame, and a filler material such as solder or brazing filler metal is infiltrated into the through hole and the lead frame is soldered to the electrode of an electronic component element. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3151588U JPH01135737U (en) | 1988-03-09 | 1988-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3151588U JPH01135737U (en) | 1988-03-09 | 1988-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135737U true JPH01135737U (en) | 1989-09-18 |
Family
ID=31257419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3151588U Pending JPH01135737U (en) | 1988-03-09 | 1988-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006040928A (en) * | 2004-07-22 | 2006-02-09 | Nec Electronics Corp | Semiconductor device |
-
1988
- 1988-03-09 JP JP3151588U patent/JPH01135737U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006040928A (en) * | 2004-07-22 | 2006-02-09 | Nec Electronics Corp | Semiconductor device |
| JP4550503B2 (en) * | 2004-07-22 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
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