JPH0350754U - - Google Patents
Info
- Publication number
- JPH0350754U JPH0350754U JP11115389U JP11115389U JPH0350754U JP H0350754 U JPH0350754 U JP H0350754U JP 11115389 U JP11115389 U JP 11115389U JP 11115389 U JP11115389 U JP 11115389U JP H0350754 U JPH0350754 U JP H0350754U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode part
- solder
- connection
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図ないし第３図は本考案の一実施例による
接続構造を説明するための図であり、第１図は該
実施例構造に使用される電子部品を示す斜視図、
第２図は上記電子部品の要部拡大断面図、第３図
ａ，ｂ，ｃ，ｄは各々上記構造の接続方法を説明
するための工程図、第４図は従来の電子部品の接
続構造を説明するための図である。
図において１０は電子部品、１１は電子部品本
体、１２は電極部、１３は半田層である。
1 to 3 are diagrams for explaining a connection structure according to an embodiment of the present invention, and FIG. 1 is a perspective view showing electronic components used in the structure of the embodiment,
Fig. 2 is an enlarged sectional view of the main part of the electronic component, Fig. 3 a, b, c, and d are process diagrams for explaining the connection method of the above structure, and Fig. 4 is a conventional connection structure of the electronic component. FIG. In the figure, 10 is an electronic component, 11 is an electronic component main body, 12 is an electrode portion, and 13 is a solder layer.
Claims (1)
電極部の外表面に半田層を形成し、接続すべき一
方の電子部品の電極部外表面の一部と他方の電子
部品の電極部外表面の一部とが、該両面を接触さ
せて加熱することにより半田を溶融凝固させて接
続されていることを特徴とする電子部品の接続構
造。 A connection electrode part is provided at the end of the electronic component body, a solder layer is formed on the outer surface of the electrode part, and a part of the outer surface of the electrode part of one electronic component to be connected and the electrode part of the other electronic component are connected. 1. A connection structure for an electronic component, characterized in that a part of an outer surface is connected by bringing both surfaces into contact and heating to melt and solidify solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11115389U JPH0350754U (en) | 1989-09-22 | 1989-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11115389U JPH0350754U (en) | 1989-09-22 | 1989-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350754U true JPH0350754U (en) | 1991-05-17 |
Family
ID=31659650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11115389U Pending JPH0350754U (en) | 1989-09-22 | 1989-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350754U (en) |
-
1989
- 1989-09-22 JP JP11115389U patent/JPH0350754U/ja active Pending
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