JPS63124755U - - Google Patents
Info
- Publication number
- JPS63124755U JPS63124755U JP1987015006U JP1500687U JPS63124755U JP S63124755 U JPS63124755 U JP S63124755U JP 1987015006 U JP1987015006 U JP 1987015006U JP 1500687 U JP1500687 U JP 1500687U JP S63124755 U JPS63124755 U JP S63124755U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- bonded
- integrated circuit
- hybrid integrated
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示す混成
集積回路装置の平面図および側面図、第２図はこ
の考案の外部リードの先端接着部の形状を示す斜
視図、第３図ａ，ｂは従来の混成集積回路装置を
示す平面図および側面図、第４図は従来の外部リ
ードを示す斜視図である。
図において、１は放熱板、２はセラミツク基板
、３は外部リード、３ａは先端接着部、４ははん
だ、５は導体部分である。
Figures 1a and b are a plan view and a side view of a hybrid integrated circuit device showing an embodiment of this invention, Figure 2 is a perspective view showing the shape of the bonded end of the external lead of this invention, and Figure 3a. , b are a plan view and a side view showing a conventional hybrid integrated circuit device, and FIG. 4 is a perspective view showing a conventional external lead. In the figure, 1 is a heat sink, 2 is a ceramic substrate, 3 is an external lead, 3a is a bonded tip, 4 is solder, and 5 is a conductor portion.
Claims (1)
部分に外部リードが接着された混成集積回路装置
において、前記外部リードの先端接着部を加圧に
よる平坦状に形成したことを特徴とする混成集積
回路装置。 A hybrid integrated circuit device in which an external lead is bonded to a conductor portion formed on a ceramic substrate on a heat sink, characterized in that the tip bonded portion of the external lead is formed into a flat shape by applying pressure. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015006U JPS63124755U (en) | 1987-02-04 | 1987-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987015006U JPS63124755U (en) | 1987-02-04 | 1987-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124755U true JPS63124755U (en) | 1988-08-15 |
Family
ID=30805534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987015006U Pending JPS63124755U (en) | 1987-02-04 | 1987-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124755U (en) |
-
1987
- 1987-02-04 JP JP1987015006U patent/JPS63124755U/ja active Pending