JPH03122548U - - Google Patents

Info

Publication number
JPH03122548U
JPH03122548U JP1990031397U JP3139790U JPH03122548U JP H03122548 U JPH03122548 U JP H03122548U JP 1990031397 U JP1990031397 U JP 1990031397U JP 3139790 U JP3139790 U JP 3139790U JP H03122548 U JPH03122548 U JP H03122548U
Authority
JP
Japan
Prior art keywords
ceramic substrate
bonded
metal fin
semiconductor device
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990031397U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990031397U priority Critical patent/JPH03122548U/ja
Publication of JPH03122548U publication Critical patent/JPH03122548U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例による半導体装置
の断面図、第２図は第１図の斜視図、第３図ａは
従来の半導体装置の断面図、第３図ｂはａ図を誇
張して示した説明断面図、第４図は第３図ａの斜
視図である。 図において、１はセラミツク基板、２は金属フ
イン、３はセラミツク基板１と金属フイン２を接
着する半田を示す。なお、図中、同一符号は同一
、または相当部分を示す。 Figure 1 is a sectional view of a semiconductor device according to an embodiment of the invention, Figure 2 is a perspective view of Figure 1, Figure 3a is a sectional view of a conventional semiconductor device, and Figure 3b is an exaggerated version of Figure a. FIG. 4 is a perspective view of FIG. 3a. In the figure, 1 is a ceramic substrate, 2 is a metal fin, and 3 is solder for bonding the ceramic substrate 1 and the metal fin 2 together. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路が形成されたセラミツク基板とこのセラミ
ツク基板に接着される金属フインを備え、前記接
着される金属フインが多数に分割されていること
を特徴とする半導体装置。 1. A semiconductor device comprising a ceramic substrate on which a circuit is formed and a metal fin bonded to the ceramic substrate, wherein the metal fin to be bonded is divided into many pieces.
JP1990031397U 1990-03-27 1990-03-27 Pending JPH03122548U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990031397U JPH03122548U (en) 1990-03-27 1990-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990031397U JPH03122548U (en) 1990-03-27 1990-03-27

Publications (1)

Publication Number Publication Date
JPH03122548U true JPH03122548U (en) 1991-12-13

Family

ID=31534151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990031397U Pending JPH03122548U (en) 1990-03-27 1990-03-27

Country Status (1)

Country Link
JP (1) JPH03122548U (en)

Similar Documents

Publication Publication Date Title
JPH03122548U (en)
JPS6316457U (en)
JPH0235443U (en)
JPH01176950U (en)
JPH038446U (en)
JPH01157424U (en)
JPH0397939U (en)
JPS622254U (en)
JPS60106375U (en) Mounting structure of external lead terminal
JPH0418453U (en)
JPH02146453U (en)
JPH0268451U (en)
JPH01154646U (en)
JPS5889946U (en) semiconductor equipment
JPH0229535U (en)
JPS6355548U (en)
JPH0474412U (en)
JPS63124755U (en)
JPS587338U (en) Ground chip for semiconductor devices
JPH044742U (en)
JPS63153547U (en)
JPH02142533U (en)
JPS63105331U (en)
JPH0341946U (en)
JPS6183041U (en)