JPS6355548U - - Google Patents
Info
- Publication number
- JPS6355548U JPS6355548U JP1986150241U JP15024186U JPS6355548U JP S6355548 U JPS6355548 U JP S6355548U JP 1986150241 U JP1986150241 U JP 1986150241U JP 15024186 U JP15024186 U JP 15024186U JP S6355548 U JPS6355548 U JP S6355548U
- Authority
- JP
- Japan
- Prior art keywords
- concave part
- heat sink
- component mounting
- mounting board
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＡ―Ａ線断面図、第３図は従来例を
示す平面図、第４図は第３図のＡ―Ａ線断面図で
ある。
１……放熱板、２……部品塔載基板、３……部
品、４……端子、５……基板接着材、６……部品
塔載用はんだ。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figures are a sectional view taken along the line AA in FIG. 1, FIG. 3 is a plan view showing a conventional example, and FIG. 4 is a sectional view taken along the line AA in FIG. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Component mounting board, 3... Component, 4... Terminal, 5... Board adhesive, 6... Part mounting solder.
Claims (1)
に部品塔載基板を取り付けたことを特徴とする半
導体装置。 A semiconductor device characterized in that a component mounting board is attached to a concave part of a heat sink having a concave part except for the surrounding area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150241U JPS6355548U (en) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150241U JPS6355548U (en) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355548U true JPS6355548U (en) | 1988-04-14 |
Family
ID=31066205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986150241U Pending JPS6355548U (en) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355548U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100462A (en) * | 1977-02-15 | 1978-09-01 | Matsushita Electric Ind Co Ltd | Method of producing hyb ic |
-
1986
- 1986-09-29 JP JP1986150241U patent/JPS6355548U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100462A (en) * | 1977-02-15 | 1978-09-01 | Matsushita Electric Ind Co Ltd | Method of producing hyb ic |