JPS61196219U - - Google Patents
Info
- Publication number
- JPS61196219U JPS61196219U JP7586285U JP7586285U JPS61196219U JP S61196219 U JPS61196219 U JP S61196219U JP 7586285 U JP7586285 U JP 7586285U JP 7586285 U JP7586285 U JP 7586285U JP S61196219 U JPS61196219 U JP S61196219U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- semiconductor chip
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
第１図、第２図はともに本考案フレキシブルプ
リント基板の夫々異なる実施例を示す上面図、第
３図はフレキシブルプリント基板に半導体チツプ
を取り付けるときの取付構造を示す斜視図である
。
１…半導体チツプ、２，２…ボンデイングパツ
ド、３…フレキシブルプリント基板、４，４…電
極、５…開口、６，６…残存領域、Ｄ…ボンデイ
ング領域。
1 and 2 are top views showing different embodiments of the flexible printed circuit board of the present invention, and FIG. 3 is a perspective view showing a mounting structure for mounting a semiconductor chip on the flexible printed circuit board. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2, 2... Bonding pad, 3... Flexible printed circuit board, 4, 4... Electrode, 5... Opening, 6, 6... Remaining region, D... Bonding region.
Claims (1)
ドされるフレキシブルプリント基板において、上
記半導体チツプがフエイスダウンボンドされるボ
ンデイング領域内に、少くともこのボンデイング
領域の角部には十分基板材料を残存させた形状の
開口を設けてなるフレキシブルプリント基板。 In a flexible printed circuit board to which a rectangular semiconductor chip is face-down bonded, an opening in a bonding area where the semiconductor chip is face-down bonded has a shape such that sufficient substrate material remains at least in the corners of this bonding area. A flexible printed circuit board with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586285U JPS61196219U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586285U JPS61196219U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196219U true JPS61196219U (en) | 1986-12-06 |
Family
ID=30617476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7586285U Pending JPS61196219U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196219U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082471A (en) * | 2009-10-12 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | Electronic-component housing type printed board and method for manufacturing the same |
-
1985
- 1985-05-22 JP JP7586285U patent/JPS61196219U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082471A (en) * | 2009-10-12 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | Electronic-component housing type printed board and method for manufacturing the same |