JPH0189755U - - Google Patents

Info

Publication number
JPH0189755U
JPH0189755U JP18555987U JP18555987U JPH0189755U JP H0189755 U JPH0189755 U JP H0189755U JP 18555987 U JP18555987 U JP 18555987U JP 18555987 U JP18555987 U JP 18555987U JP H0189755 U JPH0189755 U JP H0189755U
Authority
JP
Japan
Prior art keywords
main body
body part
double
adhesive tape
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18555987U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18555987U priority Critical patent/JPH0189755U/ja
Publication of JPH0189755U publication Critical patent/JPH0189755U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の斜視図である。 １……本体部、２……パツド、３……両面接着
テープ、４……ＳＯＰのＦ―ＩＣ。 FIG. 1 is a perspective view of an embodiment of the present invention. 1...Body part, 2...Pad, 3...Double-sided adhesive tape, 4...SOP F-IC.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板上に形成した電子回路上に搭載して
パツケージ内に収容できる上面にＩＣを搭載する
本体部と、該本体部の前記上面に形成された前記
ＩＣとの接続用の複数のパツドと、前記本体部の
底面に貼付けられた両面接着テープとを有するこ
とを特徴とするＩＣ搭載用基板。 a main body part on which an IC is mounted on an upper surface that can be mounted on an electronic circuit formed on a semiconductor substrate and accommodated in a package; a plurality of pads for connection with the IC formed on the upper surface of the main body part; A board for mounting an IC, comprising a double-sided adhesive tape affixed to the bottom surface of the main body.
JP18555987U 1987-12-04 1987-12-04 Pending JPH0189755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18555987U JPH0189755U (en) 1987-12-04 1987-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18555987U JPH0189755U (en) 1987-12-04 1987-12-04

Publications (1)

Publication Number Publication Date
JPH0189755U true JPH0189755U (en) 1989-06-13

Family

ID=31476860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18555987U Pending JPH0189755U (en) 1987-12-04 1987-12-04

Country Status (1)

Country Link
JP (1) JPH0189755U (en)

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