JPS6370163U - - Google Patents

Info

Publication number
JPS6370163U
JPS6370163U JP16318486U JP16318486U JPS6370163U JP S6370163 U JPS6370163 U JP S6370163U JP 16318486 U JP16318486 U JP 16318486U JP 16318486 U JP16318486 U JP 16318486U JP S6370163 U JPS6370163 U JP S6370163U
Authority
JP
Japan
Prior art keywords
electronic component
lead
protrude
protruding
signal pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16318486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16318486U priority Critical patent/JPS6370163U/ja
Publication of JPS6370163U publication Critical patent/JPS6370163U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a〜cは本考案の電子部品(LSIパツ
ケージ)を示し、第1図aは正面図、第1図bは
底面図、第1図cは側面図、第2図は本考案の配
線基板を示す図、第3図乃至第5図は従来例を示
し、第3図a〜cはPGA型のパツケージを示し
、第4図a,bはフラツト型のパツケージを示し
、第5図a,bはチツプキヤリー型のパツケージ
を示す。 1……電子部品(LSIパツケージ)、3……
信号ピン、5……リード、10……配線基板、1
1……孔、12……パツド。
Figures 1 a to c show the electronic component (LSI package) of the present invention, where Figure 1 a is a front view, Figure 1 b is a bottom view, Figure 1 c is a side view, and Figure 2 is a side view of the present invention. 3 to 5 show conventional examples, FIGS. 3 a to 3 c show PGA type packages, FIGS. 4 a and b show flat type packages, and FIGS. a and b indicate chip carrier type packages. 1...Electronic components (LSI package), 3...
Signal pin, 5... Lead, 10... Wiring board, 1
1...hole, 12...pad.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品1の底部2より信号ピン3を突出させ
、その側部4よりリード5を突出させ、この電子
部品1が実装された配線基板10上に、上記底部
2から突出した信号ピン3が挿入される孔11と
、上記側部4から突出したリード5を被着するパ
ツド12を設けたことを特徴とする電子部品の実
装構造。
A signal pin 3 is made to protrude from the bottom part 2 of the electronic component 1, a lead 5 is made to protrude from the side part 4, and the signal pin 3 protruding from the bottom part 2 is inserted onto the wiring board 10 on which the electronic component 1 is mounted. A mounting structure for an electronic component, characterized in that a pad 12 is provided on which a lead 5 protruding from the side portion 4 is attached.
JP16318486U 1986-10-24 1986-10-24 Pending JPS6370163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16318486U JPS6370163U (en) 1986-10-24 1986-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16318486U JPS6370163U (en) 1986-10-24 1986-10-24

Publications (1)

Publication Number Publication Date
JPS6370163U true JPS6370163U (en) 1988-05-11

Family

ID=31091149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16318486U Pending JPS6370163U (en) 1986-10-24 1986-10-24

Country Status (1)

Country Link
JP (1) JPS6370163U (en)

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