JPS6344450U - - Google Patents
Info
- Publication number
- JPS6344450U JPS6344450U JP13890286U JP13890286U JPS6344450U JP S6344450 U JPS6344450 U JP S6344450U JP 13890286 U JP13890286 U JP 13890286U JP 13890286 U JP13890286 U JP 13890286U JP S6344450 U JPS6344450 U JP S6344450U
- Authority
- JP
- Japan
- Prior art keywords
- package
- cap
- creedless
- ceramic
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のＩＣパツケージの投射図、第
２図は本考案のＩＣパツケージの実装時の断面図
、第３図は従来のＩＣパツケージの投射図である
。
１……本体、２……キヤツプ、３……パツド、
４……プリント基板、５……プリント基板のパツ
ド、６……スルーホール、７……半田付部。
FIG. 1 is a projected view of the IC package of the present invention, FIG. 2 is a sectional view of the IC package of the present invention when it is mounted, and FIG. 3 is a projected view of the conventional IC package. 1...Main body, 2...Cap, 3...Pad,
4...Printed circuit board, 5...Printed circuit board pad, 6...Through hole, 7...Soldering part.
Claims (1)
ＣＣ）において、半田付用パツドがパツケージ底
面からキヤツプ上面まで接続されている構造を有
することを特徴とするＩＣパツケージ。 Ceramic creedless chip carrier (hereinafter referred to as L)
CC), an IC package characterized in that the soldering pad is connected from the bottom of the package to the top of the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13890286U JPS6344450U (en) | 1986-09-09 | 1986-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13890286U JPS6344450U (en) | 1986-09-09 | 1986-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6344450U true JPS6344450U (en) | 1988-03-25 |
Family
ID=31044304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13890286U Pending JPS6344450U (en) | 1986-09-09 | 1986-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344450U (en) |
-
1986
- 1986-09-09 JP JP13890286U patent/JPS6344450U/ja active Pending