JPS60151137U - Chippukiyariya - Google Patents

Chippukiyariya

Info

Publication number
JPS60151137U
JPS60151137U JP3867584U JP3867584U JPS60151137U JP S60151137 U JPS60151137 U JP S60151137U JP 3867584 U JP3867584 U JP 3867584U JP 3867584 U JP3867584 U JP 3867584U JP S60151137 U JPS60151137 U JP S60151137U
Authority
JP
Japan
Prior art keywords
base
semiconductor element
lead
base body
chippukiyariya
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3867584U
Other languages
Japanese (ja)
Inventor
国松　廉可
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP3867584U priority Critical patent/JPS60151137U/en
Publication of JPS60151137U publication Critical patent/JPS60151137U/en
Pending legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のチップキャリアの断面図、第２図は本考
案のキャップキャリアの一実施例を示す断面図である。 １：絶縁基体、２，２ａ、２ｂ、２ｃ：メタライズリー
ド、３：蓋体、４：半導体素子、８ニスルーホール。FIG. 1 is a sectional view of a conventional chip carrier, and FIG. 2 is a sectional view showing an embodiment of the cap carrier of the present invention. 1: insulating base, 2, 2a, 2b, 2c: metallized leads, 3: lid, 4: semiconductor element, 8 varnished through holes.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基体と蓋体とから成り、内部に半導体素子を収納す
るチップキャリアにおいて、半導体素子が接続されるメ
タライズリードが絶縁基体の上面からスルーホールを介
して基体側面に導出され、かつこの導出部から基体側面
を介して基体底面にまで延長されていることを特徴とす
るチツプキャIn a chip carrier that consists of an insulating base and a lid and houses a semiconductor element inside, the metallized lead to which the semiconductor element is connected is led out from the top surface of the insulating base to the side surface of the base via a through hole, and from this lead-out part. A chip cap characterized by extending to the bottom surface of the base body through the side surface of the base body.
JP3867584U 1984-03-16 1984-03-16 Chippukiyariya Pending JPS60151137U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3867584U JPS60151137U (en) 1984-03-16 1984-03-16 Chippukiyariya

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3867584U JPS60151137U (en) 1984-03-16 1984-03-16 Chippukiyariya

Publications (1)

Publication Number Publication Date
JPS60151137U true JPS60151137U (en) 1985-10-07

Family

ID=30545903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3867584U Pending JPS60151137U (en) 1984-03-16 1984-03-16 Chippukiyariya

Country Status (1)

Country Link
JP (1) JPS60151137U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340698A (en) * 1999-06-01 2000-12-08 New Japan Radio Co Ltd Substrate for leadless chip carrier and leadless chip carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340698A (en) * 1999-06-01 2000-12-08 New Japan Radio Co Ltd Substrate for leadless chip carrier and leadless chip carrier

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