JPS5869956U - semiconductor package - Google Patents
semiconductor packageInfo
- Publication number
- JPS5869956U JPS5869956U JP16525381U JP16525381U JPS5869956U JP S5869956 U JPS5869956 U JP S5869956U JP 16525381 U JP16525381 U JP 16525381U JP 16525381 U JP16525381 U JP 16525381U JP S5869956 U JPS5869956 U JP S5869956U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- external lead
- insulating container
- semiconductor
- houses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第、１図は従来の半導体パッケージを使用した半導体装
置の斜視図、第２図は第１図の断面図、第３図は本考案
の半導体パッケージを使用した半導体装置の斜視図であ
る。
１：基体、２：蓋体、４：外部リード端子、７：延在部
。1 is a perspective view of a semiconductor device using a conventional semiconductor package, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a perspective view of a semiconductor device using a semiconductor package of the present invention. 1: Base body, 2: Lid body, 4: External lead terminal, 7: Extension part.
Claims (1)
リード端子が取付けられて成る半導体パッケージにおい
て、最外端に位置する外部リード端子に、絶縁容器の側
面の少なくとも一部に当接す−る延在部を形成したこと
を特徴とする半導体パッケージ。In a semiconductor package in which a plurality of external lead terminals are attached to an insulating container that houses a semiconductor element inside, the outermost external lead terminal is in contact with at least a part of the side surface of the insulating container. A semiconductor package characterized in that an extended portion is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16525381U JPS5869956U (en) | 1981-11-04 | 1981-11-04 | semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16525381U JPS5869956U (en) | 1981-11-04 | 1981-11-04 | semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869956U true JPS5869956U (en) | 1983-05-12 |
Family
ID=29957458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16525381U Pending JPS5869956U (en) | 1981-11-04 | 1981-11-04 | semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869956U (en) |
-
1981
- 1981-11-04 JP JP16525381U patent/JPS5869956U/en active Pending
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