JPH0482849U - - Google Patents

Info

Publication number
JPH0482849U
JPH0482849U JP12759090U JP12759090U JPH0482849U JP H0482849 U JPH0482849 U JP H0482849U JP 12759090 U JP12759090 U JP 12759090U JP 12759090 U JP12759090 U JP 12759090U JP H0482849 U JPH0482849 U JP H0482849U
Authority
JP
Japan
Prior art keywords
external lead
lead terminals
package
connecting member
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12759090U
Other languages
Japanese (ja)
Other versions
JP2541762Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990127590U priority Critical patent/JP2541762Y2/en
Publication of JPH0482849U publication Critical patent/JPH0482849U/ja
Application granted granted Critical
Publication of JP2541762Y2 publication Critical patent/JP2541762Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの絶縁基体の斜視図、第３図は
従来の半導体素子収納用パツケージの断面図、第
４図は第３図に示すパツケージの平面図である。 １……絶縁基体、２……蓋体、３……絶縁容器
、７……外部リード端子、８……連結部材、１０
……テスト用パツド。 FIG. 1 is a sectional view showing an embodiment of a package for storing semiconductor elements according to the present invention, FIG. 2 is a perspective view of an insulating base of the package shown in FIG. 1, and FIG. 3 is a view of a conventional package for storing semiconductor elements. FIG. 4 is a plan view of the package shown in FIG. 3. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Lid, 3... Insulating container, 7... External lead terminal, 8... Connecting member, 10
...Test pad.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に半導体素子を収容するための空所を有す
る絶縁容器に複数の外部リード端子を取着すると
ともに該外部リード端子の各々の自由端近傍を電
気絶縁性の連結部材を介して共通に連結して成る
半導体素子収納用パツケージにおいて、前記電気
絶縁性の連結部材はその外表面に前記各外部リー
ド端子の個々と電気的に接続している複数個のテ
スト用パツドが設けられていることを特徴とする
半導体素子収納用パツケージ。 A plurality of external lead terminals are attached to an insulating container having a cavity for accommodating a semiconductor element therein, and the vicinity of the free end of each of the external lead terminals is commonly connected via an electrically insulating connecting member. In the package for storing semiconductor elements, the electrically insulating connecting member is provided with a plurality of test pads on its outer surface, each of which is electrically connected to each of the external lead terminals. Package cage for storing semiconductor elements.
JP1990127590U 1990-11-28 1990-11-28 Package for storing semiconductor elements Expired - Lifetime JP2541762Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990127590U JP2541762Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127590U JP2541762Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor elements

Publications (2)

Publication Number Publication Date
JPH0482849U true JPH0482849U (en) 1992-07-20
JP2541762Y2 JP2541762Y2 (en) 1997-07-16

Family

ID=31875084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127590U Expired - Lifetime JP2541762Y2 (en) 1990-11-28 1990-11-28 Package for storing semiconductor elements

Country Status (1)

Country Link
JP (1) JP2541762Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089897A (en) * 2012-02-07 2012-05-10 Kyocera Corp Electronic element carrier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519817A (en) * 1978-07-28 1980-02-12 Hitachi Ltd Integrated circuit lead protecting device
JPS60195959A (en) * 1984-03-19 1985-10-04 Hitachi Ltd Lead frame and manufacture thereof
JPS63132444U (en) * 1987-02-23 1988-08-30

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519817A (en) * 1978-07-28 1980-02-12 Hitachi Ltd Integrated circuit lead protecting device
JPS60195959A (en) * 1984-03-19 1985-10-04 Hitachi Ltd Lead frame and manufacture thereof
JPS63132444U (en) * 1987-02-23 1988-08-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089897A (en) * 2012-02-07 2012-05-10 Kyocera Corp Electronic element carrier

Also Published As

Publication number Publication date
JP2541762Y2 (en) 1997-07-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term