JPS6230356U - - Google Patents
Info
- Publication number
- JPS6230356U JPS6230356U JP12108285U JP12108285U JPS6230356U JP S6230356 U JPS6230356 U JP S6230356U JP 12108285 U JP12108285 U JP 12108285U JP 12108285 U JP12108285 U JP 12108285U JP S6230356 U JPS6230356 U JP S6230356U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- integrated circuit
- semiconductor integrated
- circuit element
- plate part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案装置の１実施例の構成斜視図、
第２図は同装置の中央横増面図、第３図は同装置
に備えるシールド部の構成斜視図である。
１…樹脂製パツケージ、２，３…複数のリード
ピン、４…シールド部、４ａ…プレート部、４ｂ
…端子部。
FIG. 1 is a perspective view of the configuration of one embodiment of the device of the present invention;
FIG. 2 is a central lateral enlarged view of the device, and FIG. 3 is a perspective view of the configuration of a shield section provided in the device. 1... Resin package, 2, 3... Plural lead pins, 4... Shield part, 4a... Plate part, 4b
...Terminal section.
Claims (1)
製パツケージと、該樹脂製パツケージ内部におい
て一端部が前記半導体集積回路要素に接続され他
端部が前記樹脂製パツケージの外方に突設されて
いる複数のリードピンと、前記樹脂製パツケージ
の天面をカバーするプレート部と前記複数のリー
ドピンのうちの接地用リードピンに対応する位置
に前記プレート部から延在する端子部とを有する
シールド部とを備え、該シールド部は前記端子部
と前記接地用リードピンの接続を通じて前記樹脂
製パツケージに支持されていることを特徴とする
半導体集積回路装置。 A resin package having a semiconductor integrated circuit element housed therein; and one end of the resin package inside the resin package connected to the semiconductor integrated circuit element and the other end protruding outward from the resin package. A shield part having a plurality of lead pins, a plate part that covers the top surface of the resin package, and a terminal part extending from the plate part at a position corresponding to a grounding lead pin among the plurality of lead pins. . A semiconductor integrated circuit device, wherein the shield portion is supported by the resin package through a connection between the terminal portion and the grounding lead pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12108285U JPS6230356U (en) | 1985-08-07 | 1985-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12108285U JPS6230356U (en) | 1985-08-07 | 1985-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230356U true JPS6230356U (en) | 1987-02-24 |
Family
ID=31010011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12108285U Pending JPS6230356U (en) | 1985-08-07 | 1985-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230356U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623754A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Semiconductor device |
| JPS58122759A (en) * | 1982-01-14 | 1983-07-21 | Fujitsu Ltd | Semiconductor device |
-
1985
- 1985-08-07 JP JP12108285U patent/JPS6230356U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623754A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Semiconductor device |
| JPS58122759A (en) * | 1982-01-14 | 1983-07-21 | Fujitsu Ltd | Semiconductor device |