JPS5933255U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5933255U JPS5933255U JP12959682U JP12959682U JPS5933255U JP S5933255 U JPS5933255 U JP S5933255U JP 12959682 U JP12959682 U JP 12959682U JP 12959682 U JP12959682 U JP 12959682U JP S5933255 U JPS5933255 U JP S5933255U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- container
- electrode
- caulking portion
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体装置、第２図は本考案の半導体
装置の外部リードカシメ部の詳細図でａ図は断面図、ｂ
図は側面図、Ｃ図は外面図である。
図において１はベース電極、２は半導体チップ、３は接
続子、４は気密容器、４ａは外部リード結合端子、４ｂ
は結合部、４Ｃは主結合部（カシメ部）、４ｄは部分結
合部（カシメ部）、５は外部リード線である。FIG. 1 is a detailed view of the external lead caulking portion of a conventional semiconductor device, and FIG. 2 is a detailed view of the external lead caulking portion of the semiconductor device of the present invention.
The figure is a side view, and figure C is an external view. In the figure, 1 is a base electrode, 2 is a semiconductor chip, 3 is a connector, 4 is an airtight container, 4a is an external lead connection terminal, 4b
4C is a main connection portion (crimped portion), 4d is a partial connection portion (crimped portion), and 5 is an external lead wire.
Claims (1)
ると共に、容器上方において容器壁とガラスブッシング
等により装着された外部リード結合端子に前記半導体基
体の他方の電極と接続子によって接続するように構成さ
れた半導体装置において、外部リード線を前記外部リー
ド結合端子に主カシメ部と部分カシメ部の複数結合部に
より結合することを特徴とする半導体装置。A semiconductor substrate is fixed on the bottom of the container forming one electrode, and the other electrode of the semiconductor substrate is connected by a connector to an external lead coupling terminal attached to the container wall and a glass bushing, etc. above the container. 1. A semiconductor device configured in this manner, wherein an external lead wire is coupled to the external lead coupling terminal by a plurality of coupling portions including a main caulking portion and a partial caulking portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12959682U JPS5933255U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12959682U JPS5933255U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5933255U true JPS5933255U (en) | 1984-03-01 |
Family
ID=30293593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12959682U Pending JPS5933255U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933255U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474961U (en) * | 1990-11-07 | 1992-06-30 |
-
1982
- 1982-08-27 JP JP12959682U patent/JPS5933255U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474961U (en) * | 1990-11-07 | 1992-06-30 |
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