JPS5853158U - semiconductor integrated circuit - Google Patents

semiconductor integrated circuit

Info

Publication number
JPS5853158U
JPS5853158U JP14923581U JP14923581U JPS5853158U JP S5853158 U JPS5853158 U JP S5853158U JP 14923581 U JP14923581 U JP 14923581U JP 14923581 U JP14923581 U JP 14923581U JP S5853158 U JPS5853158 U JP S5853158U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
resin
external terminals
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14923581U
Other languages
Japanese (ja)
Inventor
益井　寿彦
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14923581U priority Critical patent/JPS5853158U/en
Publication of JPS5853158U publication Critical patent/JPS5853158U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の断面図、第２図は従来例の
断面図を示す。 １．１１・・・・・・封入樹脂、２，１２・・・・・・
外部端子、３．１３・・・・・・折り曲げ点。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1.11... Sealing resin, 2,12...
External terminal, 3.13...Bending point.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を樹脂にて封止し、樹脂側面から複数の外部
端子を導出してなる半導体集積回路に於いて、前記外部
端子を封入樹脂側面より折り曲げたことを特徴とする半
導体集積回路。1. A semiconductor integrated circuit comprising a semiconductor element sealed with resin and a plurality of external terminals led out from a side surface of the resin, wherein the external terminals are bent from the side surface of the encapsulating resin.
JP14923581U 1981-10-07 1981-10-07 semiconductor integrated circuit Pending JPS5853158U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14923581U JPS5853158U (en) 1981-10-07 1981-10-07 semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14923581U JPS5853158U (en) 1981-10-07 1981-10-07 semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5853158U true JPS5853158U (en) 1983-04-11

Family

ID=29942014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14923581U Pending JPS5853158U (en) 1981-10-07 1981-10-07 semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5853158U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134578A (en) * 1974-04-10 1975-10-24
JPS54141371A (en) * 1978-04-26 1979-11-02 Yamada Seisakusho Kk Method of bending lead frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134578A (en) * 1974-04-10 1975-10-24
JPS54141371A (en) * 1978-04-26 1979-11-02 Yamada Seisakusho Kk Method of bending lead frame

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