JPS58155844U - Tablet for semiconductor encapsulation - Google Patents
Tablet for semiconductor encapsulationInfo
- Publication number
- JPS58155844U JPS58155844U JP5263482U JP5263482U JPS58155844U JP S58155844 U JPS58155844 U JP S58155844U JP 5263482 U JP5263482 U JP 5263482U JP 5263482 U JP5263482 U JP 5263482U JP S58155844 U JPS58155844 U JP S58155844U
- Authority
- JP
- Japan
- Prior art keywords
- tablet
- semiconductor encapsulation
- semiconductor
- encapsulating
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来の半導体素子を封止する状態を
示す断面図、第２図ａ、 ｂは同じ〈従来の他の状態
を示す断面図、第３図はタブレットが必要な寸法を満す
ための説明図、第４図は本考案半導体封止用タブレット
の一実施例を示す斜視図、第５図はそれぞれ同じく本考
案の他の実施例を示す斜視図である。
２１・・・タブレット、２１ａ・・・切込み、２１ｂ・
・・貫通孔。Figures 1a and b are cross-sectional views showing the conventional state of sealing a semiconductor element, Figures 2a and b are cross-sectional views showing the same (other conventional state), and Figure 3 shows the required dimensions of the tablet. FIG. 4 is a perspective view showing one embodiment of the semiconductor encapsulating tablet of the present invention, and FIG. 5 is a perspective view showing another embodiment of the present invention. 21...Tablet, 21a...Notch, 21b.
...Through hole.
Claims (1)
高分子樹脂タブレットにおいて、周辺部に切り込み若く
は内部に貫通孔を適当数設けたことを特徴とする半導体
封止用タブレット。1. A tablet for semiconductor encapsulation, which is a polymer resin tablet made of an insulating material for encapsulating a semiconductor element, and is characterized by having an appropriate number of through holes cut in the periphery or inside the tablet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5263482U JPS58155844U (en) | 1982-04-13 | 1982-04-13 | Tablet for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5263482U JPS58155844U (en) | 1982-04-13 | 1982-04-13 | Tablet for semiconductor encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58155844U true JPS58155844U (en) | 1983-10-18 |
Family
ID=30063338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5263482U Pending JPS58155844U (en) | 1982-04-13 | 1982-04-13 | Tablet for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155844U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012231573A (en) * | 2011-04-25 | 2012-11-22 | Piolax Inc | Member for power distribution and method of manufacturing member for power distribution |
| WO2014027376A1 (en) * | 2012-08-14 | 2014-02-20 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | Thermosetting resin sheet, semiconductor device, and method for manufacturing semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54121674A (en) * | 1978-03-14 | 1979-09-20 | Nitto Electric Ind Co | Method of fabricating semiconductor electric component sealing resin pellet |
| JPS5622142A (en) * | 1979-07-31 | 1981-03-02 | Fujitsu Ltd | Frequent error detecting system |
| JPS5631004B2 (en) * | 1971-10-06 | 1981-07-18 |
-
1982
- 1982-04-13 JP JP5263482U patent/JPS58155844U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631004B2 (en) * | 1971-10-06 | 1981-07-18 | ||
| JPS54121674A (en) * | 1978-03-14 | 1979-09-20 | Nitto Electric Ind Co | Method of fabricating semiconductor electric component sealing resin pellet |
| JPS5622142A (en) * | 1979-07-31 | 1981-03-02 | Fujitsu Ltd | Frequent error detecting system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012231573A (en) * | 2011-04-25 | 2012-11-22 | Piolax Inc | Member for power distribution and method of manufacturing member for power distribution |
| WO2014027376A1 (en) * | 2012-08-14 | 2014-02-20 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | Thermosetting resin sheet, semiconductor device, and method for manufacturing semiconductor device |
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