JPS5858336U - Transparent resin tablet for semiconductor device encapsulation - Google Patents

Transparent resin tablet for semiconductor device encapsulation

Info

Publication number
JPS5858336U
JPS5858336U JP15385681U JP15385681U JPS5858336U JP S5858336 U JPS5858336 U JP S5858336U JP 15385681 U JP15385681 U JP 15385681U JP 15385681 U JP15385681 U JP 15385681U JP S5858336 U JPS5858336 U JP S5858336U
Authority
JP
Japan
Prior art keywords
transparent resin
semiconductor device
resin tablet
device encapsulation
encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15385681U
Other languages
Japanese (ja)
Inventor
江口　伸生
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP15385681U priority Critical patent/JPS5858336U/en
Publication of JPS5858336U publication Critical patent/JPS5858336U/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体素子封止用透明樹脂タブレットを
示す斜視図、第２図はこの考案の一実施例の半導体素子
封止用透明樹脂タブレットを示す斜視図である。FIG. 1 is a perspective view showing a conventional transparent resin tablet for encapsulating a semiconductor element, and FIG. 2 is a perspective view showing a transparent resin tablet for encapsulating a semiconductor element according to an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 液状の透明樹脂を重合させてほぼ球形状に予備成形した
熱可塑性透明樹脂部材からなりこれを溶融させて半導体
素子の封止に用いるようにしたことを特徴とする半導体
素子封止用透明樹脂タブレット。1. A transparent resin tablet for encapsulating a semiconductor element, comprising a thermoplastic transparent resin member preformed into an almost spherical shape by polymerizing a liquid transparent resin, which is melted and used for encapsulating a semiconductor element. .
JP15385681U 1981-10-14 1981-10-14 Transparent resin tablet for semiconductor device encapsulation Pending JPS5858336U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15385681U JPS5858336U (en) 1981-10-14 1981-10-14 Transparent resin tablet for semiconductor device encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15385681U JPS5858336U (en) 1981-10-14 1981-10-14 Transparent resin tablet for semiconductor device encapsulation

Publications (1)

Publication Number Publication Date
JPS5858336U true JPS5858336U (en) 1983-04-20

Family

ID=29946457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15385681U Pending JPS5858336U (en) 1981-10-14 1981-10-14 Transparent resin tablet for semiconductor device encapsulation

Country Status (1)

Country Link
JP (1) JPS5858336U (en)

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