JPS588966U - Semiconductor photodetector - Google Patents
Semiconductor photodetectorInfo
- Publication number
- JPS588966U JPS588966U JP10421481U JP10421481U JPS588966U JP S588966 U JPS588966 U JP S588966U JP 10421481 U JP10421481 U JP 10421481U JP 10421481 U JP10421481 U JP 10421481U JP S588966 U JPS588966 U JP S588966U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- resin layer
- receiving element
- semiconductor photodetector
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案装置め断面図であって、1は受光素子、2は
ステム<4はモールド体、を夫々示している6The figure is a cross-sectional view of the device according to the present invention, and 6 shows the light receiving element 1, the stem 2 and the molded body 4.
Claims (1)
れた上記受光素子をモールドするモールド体、を備え、
上記モールド体はエポキシ樹脂層、ゴム状シリコン樹脂
層及びエポキシ樹脂層の三重構造から成ることを特徴と
した半導体受光装置。comprising a light receiving element, a substrate on which the light receiving element is placed, and a mold body for molding the light receiving element placed on the substrate,
A semiconductor light receiving device characterized in that the molded body has a triple structure of an epoxy resin layer, a rubbery silicone resin layer, and an epoxy resin layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10421481U JPS588966U (en) | 1981-07-13 | 1981-07-13 | Semiconductor photodetector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10421481U JPS588966U (en) | 1981-07-13 | 1981-07-13 | Semiconductor photodetector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS588966U true JPS588966U (en) | 1983-01-20 |
Family
ID=29898823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10421481U Pending JPS588966U (en) | 1981-07-13 | 1981-07-13 | Semiconductor photodetector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS588966U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1589586A1 (en) * | 2003-01-20 | 2005-10-26 | Sharp Kabushiki Kaisha | Transparent resin composition for optical sensor filter, optical sensor and production method therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5410703A (en) * | 1977-06-27 | 1979-01-26 | Hokushin Electric Works | Magnetic recording medium |
-
1981
- 1981-07-13 JP JP10421481U patent/JPS588966U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5410703A (en) * | 1977-06-27 | 1979-01-26 | Hokushin Electric Works | Magnetic recording medium |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1589586A1 (en) * | 2003-01-20 | 2005-10-26 | Sharp Kabushiki Kaisha | Transparent resin composition for optical sensor filter, optical sensor and production method therefor |
EP1589586A4 (en) * | 2003-01-20 | 2010-10-13 | Sharp Kk | Transparent resin composition for optical sensor filter, optical sensor and production method therefor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS588966U (en) | Semiconductor photodetector | |
JPS585349U (en) | semiconductor equipment | |
JPS58440U (en) | plastic packaging | |
JPS5967944U (en) | Resin-encapsulated semiconductor device | |
JPS6048243U (en) | semiconductor equipment | |
JPS583035U (en) | Mold for resin mold | |
JPS58166034U (en) | semiconductor manufacturing equipment | |
JPS59164251U (en) | Lead frame for semiconductor devices | |
JPS594644U (en) | Resin mold semiconductor device | |
JPS6113952U (en) | Lead frame for semiconductor devices | |
JPS6115744U (en) | semiconductor equipment | |
JPS5915515U (en) | Resin mold support member | |
JPS59151446U (en) | semiconductor equipment | |
JPS60125738U (en) | Hybrid integrated circuit device | |
JPS5834742U (en) | Heat dissipation structure for resin-encapsulated semiconductor devices | |
JPS5878654U (en) | Mold type semiconductor device | |
JPS6122342U (en) | semiconductor equipment | |
JPS5989547U (en) | semiconductor equipment | |
JPS60153538U (en) | semiconductor element | |
JPS59119040U (en) | Resin-encapsulated semiconductor device | |
JPS6083205U (en) | variable resistor | |
JPS5858336U (en) | Transparent resin tablet for semiconductor device encapsulation | |
JPS588964U (en) | Photoelectric conversion element | |
JPS594648U (en) | Resin-encapsulated semiconductor device | |
JPS6068654U (en) | semiconductor equipment |