JPS594644U - Resin mold semiconductor device - Google Patents
Resin mold semiconductor deviceInfo
- Publication number
- JPS594644U JPS594644U JP9977282U JP9977282U JPS594644U JP S594644 U JPS594644 U JP S594644U JP 9977282 U JP9977282 U JP 9977282U JP 9977282 U JP9977282 U JP 9977282U JP S594644 U JPS594644 U JP S594644U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- resin mold
- resin
- mold semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の半導体装置の断面図、第２
図は放熱板側から見た平面図である。
なお図において、１・・・・・・リード部、２・・・・
・・樹脂部、３・・・・・・放熱体、４・・・・・・チ
ップ、５・・・・・・溝、である。FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention, and FIG.
The figure is a plan view seen from the heat sink side. In the figure, 1... lead part, 2...
...Resin part, 3... Heat sink, 4... Chip, 5... Groove.
Claims (1)
とができる構造の樹脂モールド半導体装置において、該
放熱体を取り囲む形で樹脂部が構成され、かつ該樹脂部
は該放熱体より突出した形に形成され、かつ該樹脂部に
は該放熱体に達する細溝が形成されていることを特徴と
する樹脂モールド半導体装置。In a resin molded semiconductor device having a heat sink and having a structure in which the heat sink can be connected to another heat sink, a resin part is configured to surround the heat sink, and the resin part is connected to the heat sink. 1. A resin-molded semiconductor device, characterized in that the resin part is formed in a more protruding shape and has a thin groove formed in the resin part that reaches the heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9977282U JPS594644U (en) | 1982-07-01 | 1982-07-01 | Resin mold semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9977282U JPS594644U (en) | 1982-07-01 | 1982-07-01 | Resin mold semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS594644U true JPS594644U (en) | 1984-01-12 |
Family
ID=30236303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9977282U Pending JPS594644U (en) | 1982-07-01 | 1982-07-01 | Resin mold semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021048181A (en) * | 2019-09-17 | 2021-03-25 | 株式会社デンソー | Semiconductor module and semiconductor device with the same |
-
1982
- 1982-07-01 JP JP9977282U patent/JPS594644U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021048181A (en) * | 2019-09-17 | 2021-03-25 | 株式会社デンソー | Semiconductor module and semiconductor device with the same |
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