JPS6083249U - integrated circuit components - Google Patents
integrated circuit componentsInfo
- Publication number
- JPS6083249U JPS6083249U JP1983176997U JP17699783U JPS6083249U JP S6083249 U JPS6083249 U JP S6083249U JP 1983176997 U JP1983176997 U JP 1983176997U JP 17699783 U JP17699783 U JP 17699783U JP S6083249 U JPS6083249 U JP S6083249U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit components
- heat sink
- groove
- molding resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の集積回路部品の断面図、第２図は本考案
の集積回路部品の一実施例を示す断面図、第３図はその
放熱体の斜視図である。
１・・・・・・半導体チップ、２・・・・・・ワイヤ、
３・・・・・・金属端子、４・・・・・・モールド樹脂
、６・・・・・・凹溝、７・・・・・・放熱体。FIG. 1 is a sectional view of a conventional integrated circuit component, FIG. 2 is a sectional view showing an embodiment of the integrated circuit component of the present invention, and FIG. 3 is a perspective view of a heat sink thereof. 1... Semiconductor chip, 2... Wire,
3... Metal terminal, 4... Molded resin, 6... Concave groove, 7... Heat sink.
Claims (1)
放熱体る半導体チップが結線された金属端子に密着させ
、モールド樹脂によって一体化されており、かつ上記放
熱体の金属端子と接する面に金属端子が突出する方向に
直角に凹溝を形成し、その凹溝にまで上記モールド樹脂
を充填して上記金属端子の全周囲をそれぞれ上記モール
ド樹脂でおおったことを特徴とする集積回路部品。The heat sink is an insulator made by anodizing the surface of an aluminum plate.The semiconductor chip is brought into close contact with the connected metal terminals, and is integrated with a molded resin.The surface of the heat sink that is in contact with the metal terminals is An integrated circuit component characterized in that a groove is formed at right angles to the direction in which the terminal projects, and the groove is filled with the molding resin so that the entire periphery of the metal terminal is covered with the molding resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983176997U JPS6083249U (en) | 1983-11-15 | 1983-11-15 | integrated circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983176997U JPS6083249U (en) | 1983-11-15 | 1983-11-15 | integrated circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6083249U true JPS6083249U (en) | 1985-06-08 |
Family
ID=30384651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983176997U Pending JPS6083249U (en) | 1983-11-15 | 1983-11-15 | integrated circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6083249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157155U (en) * | 1986-03-27 | 1987-10-06 |
-
1983
- 1983-11-15 JP JP1983176997U patent/JPS6083249U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157155U (en) * | 1986-03-27 | 1987-10-06 |
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