JPS6022838U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6022838U JPS6022838U JP11375183U JP11375183U JPS6022838U JP S6022838 U JPS6022838 U JP S6022838U JP 11375183 U JP11375183 U JP 11375183U JP 11375183 U JP11375183 U JP 11375183U JP S6022838 U JPS6022838 U JP S6022838U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor
- insulating plastic
- semiconductor device
- plastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Elimination Of Static Electricity (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の発光ダイオードの断面図であり、第２図
は本考案の一実施例を説明するための発光ダイオードの
断面図、第３図はその実施例を説明するための断面図で
ある。
１・・・発光ダイオードのリード端子、２・・・絶縁性
プラスチック樹脂、４・・・金属製シャーシ、６・・・
導電性樹脂、７Ａ、７Ｂ・・・導電プラスチック製固定
部品。Fig. 1 is a sectional view of a conventional light emitting diode, Fig. 2 is a sectional view of a light emitting diode for explaining an embodiment of the present invention, and Fig. 3 is a sectional view for explaining the embodiment. be. 1... Lead terminal of light emitting diode, 2... Insulating plastic resin, 4... Metal chassis, 6...
Conductive resin, 7A, 7B...Fixing parts made of conductive plastic.
Claims (1)
か絶縁性プラスチック樹脂で成型された半導体装置に於
いて、前記絶縁性プラスチック樹脂表面の主成又は一部
を導電性樹脂で覆い、これを前記半導体チップと電極配
線されない端子もしくは導電部材に接触したことを特徴
とする半導体装置。In a semiconductor device in which one or more semiconductor chips are arranged on a substrate and molded with an insulating plastic resin, the main part or a part of the surface of the insulating plastic resin is covered with a conductive resin, and this A semiconductor device, wherein the semiconductor chip is in contact with a terminal or a conductive member that is not connected to the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11375183U JPS6022838U (en) | 1983-07-22 | 1983-07-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11375183U JPS6022838U (en) | 1983-07-22 | 1983-07-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6022838U true JPS6022838U (en) | 1985-02-16 |
Family
ID=30263201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11375183U Pending JPS6022838U (en) | 1983-07-22 | 1983-07-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6022838U (en) |
-
1983
- 1983-07-22 JP JP11375183U patent/JPS6022838U/en active Pending
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