JPS58114049U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58114049U JPS58114049U JP965982U JP965982U JPS58114049U JP S58114049 U JPS58114049 U JP S58114049U JP 965982 U JP965982 U JP 965982U JP 965982 U JP965982 U JP 965982U JP S58114049 U JPS58114049 U JP S58114049U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor equipment
- heat sink
- mounting hole
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の側断面図、第２図は基板への固定状態
を示す側断面図、第３図は本案の一実施例を示す平面図
、第４図は第３図の側断面図、第５図は基板への固定状
態を示す側断面図、第６図は本案の他の実施例を示す平
面図、第７図は第６図の側断面図である。
図中、１は放熱板、２は取付孔、４は突出部、５は半導
体素子、６はリード、８は樹脂材である。Fig. 1 is a side sectional view of the conventional example, Fig. 2 is a side sectional view showing how it is fixed to the board, Fig. 3 is a plan view showing an embodiment of the present invention, and Fig. 4 is a side sectional view of Fig. 3. 5 is a side sectional view showing a state of fixation to a substrate, FIG. 6 is a plan view showing another embodiment of the present invention, and FIG. 7 is a side sectional view of FIG. 6. In the figure, 1 is a heat sink, 2 is a mounting hole, 4 is a protrusion, 5 is a semiconductor element, 6 is a lead, and 8 is a resin material.
Claims (1)
半導体素子の電極とリードとを電気的に接続し、かつ半
導体素子を含む主要部分を樹脂材にて被覆したものにお
いて、上記放熱板の取付孔の周辺部分に変形可能な突出
部を形成したことを特徴とする半導体装置。A semiconductor element is fixed to a heat sink having a mounting hole, and
In a device in which the electrodes and leads of the semiconductor element are electrically connected and the main part including the semiconductor element is covered with a resin material, a deformable protrusion is formed around the mounting hole of the heat sink. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP965982U JPS58114049U (en) | 1982-01-27 | 1982-01-27 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP965982U JPS58114049U (en) | 1982-01-27 | 1982-01-27 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58114049U true JPS58114049U (en) | 1983-08-04 |
Family
ID=30022283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP965982U Pending JPS58114049U (en) | 1982-01-27 | 1982-01-27 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58114049U (en) |
-
1982
- 1982-01-27 JP JP965982U patent/JPS58114049U/en active Pending
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