JPS5989547U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5989547U JPS5989547U JP18644682U JP18644682U JPS5989547U JP S5989547 U JPS5989547 U JP S5989547U JP 18644682 U JP18644682 U JP 18644682U JP 18644682 U JP18644682 U JP 18644682U JP S5989547 U JPS5989547 U JP S5989547U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor element
- semiconductor equipment
- recess
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の横断面図、第２図は第１図の側断面図
、第３図は第１図の下面図、第４図は本案の一実施例を
示す横断面図、第５図は第４図の側断面図、第６図は樹
脂モールド法を説明するための側断面図、第７図〜第８
図は本案の他の実施例を示す側断面図である。Fig. 1 is a cross-sectional view of the conventional example, Fig. 2 is a side sectional view of Fig. 1, Fig. 3 is a bottom view of Fig. 1, and Fig. 4 is a transverse sectional view showing an embodiment of the present invention. Figure 5 is a side sectional view of Figure 4, Figure 6 is a side sectional view for explaining the resin molding method, and Figures 7 to 8.
The figure is a side sectional view showing another embodiment of the present invention.
Claims (1)
子の電極とリードとを電気的に接続し、かつ半導体素子
、放熱板の裏面を含む主要部分を樹脂材にてモールド被
覆したものにおいて、上記放熱板の裏面に凹部を形成し
、この凹部の側壁を樹脂材にて被覆したことを特徴とす
る半導体装置。A semiconductor element is fixed to the surface of a heat sink, the electrodes and leads of the semiconductor element are electrically connected, and the main parts including the semiconductor element and the back surface of the heat sink are molded and coated with a resin material. A semiconductor device characterized in that a recess is formed on the back surface of a heat sink, and a side wall of the recess is covered with a resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18644682U JPS5989547U (en) | 1982-12-07 | 1982-12-07 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18644682U JPS5989547U (en) | 1982-12-07 | 1982-12-07 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5989547U true JPS5989547U (en) | 1984-06-18 |
Family
ID=30402713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18644682U Pending JPS5989547U (en) | 1982-12-07 | 1982-12-07 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989547U (en) |
-
1982
- 1982-12-07 JP JP18644682U patent/JPS5989547U/en active Pending
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