JPS5991747U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5991747U JPS5991747U JP18692282U JP18692282U JPS5991747U JP S5991747 U JPS5991747 U JP S5991747U JP 18692282 U JP18692282 U JP 18692282U JP 18692282 U JP18692282 U JP 18692282U JP S5991747 U JPS5991747 U JP S5991747U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor equipment
- leads
- thin metal
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の横断面図、第２図は第１図の側断面図
、第３図は樹脂モールド方法の説明図、第４図は本案の
一実施例を示す横断面図、第５図は第４図のＸ−Ｘ断面
図、第６図は樹脂モールド方法を説明するための側断面
図である。
図中、１は基板部、２は半導体素子、３．〜３１０はリ
ード、４は金属細線、５は屈曲部、６は樹脂材である。FIG. 1 is a cross-sectional view of a conventional example, FIG. 2 is a side cross-sectional view of FIG. 1, FIG. 3 is an explanatory diagram of the resin molding method, and FIG. 5 is a sectional view taken along line XX in FIG. 4, and FIG. 6 is a side sectional view for explaining the resin molding method. In the figure, 1 is a substrate part, 2 is a semiconductor element, and 3. 310 is a lead, 4 is a thin metal wire, 5 is a bent portion, and 6 is a resin material.
Claims (1)
極とリードとを金属細線にて接続し、かつ半導体素子を
含む主要部分を樹脂材にてモールド被覆したものにおい
て、上記リードのうち、端部に位置するリードに金属細
線の接続側に向けて傾斜する屈曲部を形成したことを特
徴とする半導体装置。In a device in which a semiconductor element is fixed to a substrate part, electrodes of the semiconductor element and leads are connected with thin metal wires, and the main part including the semiconductor element is molded and covered with a resin material, the ends of the leads are 1. A semiconductor device characterized in that a lead located at is formed with a bent portion that slopes toward a connection side of a thin metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18692282U JPS5991747U (en) | 1982-12-09 | 1982-12-09 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18692282U JPS5991747U (en) | 1982-12-09 | 1982-12-09 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5991747U true JPS5991747U (en) | 1984-06-21 |
Family
ID=30403612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18692282U Pending JPS5991747U (en) | 1982-12-09 | 1982-12-09 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5991747U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322747U (en) * | 1986-07-30 | 1988-02-15 |
-
1982
- 1982-12-09 JP JP18692282U patent/JPS5991747U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322747U (en) * | 1986-07-30 | 1988-02-15 |
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