JPS5889989U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS5889989U
JPS5889989U JP18477781U JP18477781U JPS5889989U JP S5889989 U JPS5889989 U JP S5889989U JP 18477781 U JP18477781 U JP 18477781U JP 18477781 U JP18477781 U JP 18477781U JP S5889989 U JPS5889989 U JP S5889989U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
case
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18477781U
Other languages
Japanese (ja)
Inventor
鳥羽　進
吉岡　公男
甕　建志
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP18477781U priority Critical patent/JPS5889989U/en
Publication of JPS5889989U publication Critical patent/JPS5889989U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来の構造を示す断面図及び平面図
、第３図は従来の欠点を示す断面図、第４図は本考案の
構造を示す断面図である。　　〜３は金属板、４はケー
ス、５はねじ、８は孔、９はねじ穴、１０は環状凸部。1 and 2 are a sectional view and a plan view showing the conventional structure, FIG. 3 is a sectional view showing the drawbacks of the conventional structure, and FIG. 4 is a sectional view showing the structure of the present invention. -3 is a metal plate, 4 is a case, 5 is a screw, 8 is a hole, 9 is a screw hole, and 10 is an annular convex portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース内部底面に回路形成基板を固着した金属板をねじ
止めし、該ケース内に樹脂を注入して封止する混成集積
回路装置において、前記ケースのねじ穴の周辺に環状の
凸部を形成し、それに対応する金属板の孔を凸部の外周
と密接するよう形成したことを特徴とする混成集積回路
装置。In a hybrid integrated circuit device in which a metal plate with a circuit-forming board fixed to the inside bottom of the case is screwed and sealed by injecting resin into the case, an annular convex portion is formed around the screw hole of the case. A hybrid integrated circuit device characterized in that a hole in a metal plate corresponding to the hole is formed in close contact with the outer periphery of the convex portion.
JP18477781U 1981-12-11 1981-12-11 Hybrid integrated circuit device Pending JPS5889989U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18477781U JPS5889989U (en) 1981-12-11 1981-12-11 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18477781U JPS5889989U (en) 1981-12-11 1981-12-11 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5889989U true JPS5889989U (en) 1983-06-17

Family

ID=29985233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18477781U Pending JPS5889989U (en) 1981-12-11 1981-12-11 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5889989U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151498A (en) * 2008-12-24 2010-07-08 Nippon Seiki Co Ltd Indication device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151498A (en) * 2008-12-24 2010-07-08 Nippon Seiki Co Ltd Indication device

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