JPS5889989U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS5889989U JPS5889989U JP18477781U JP18477781U JPS5889989U JP S5889989 U JPS5889989 U JP S5889989U JP 18477781 U JP18477781 U JP 18477781U JP 18477781 U JP18477781 U JP 18477781U JP S5889989 U JPS5889989 U JP S5889989U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- case
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は従来の構造を示す断面図及び平面図
、第3図は従来の欠点を示す断面図、第4図は本考案の
構造を示す断面図である。 〜3は金属板、4はケー
ス、5はねじ、8は孔、9はねじ穴、10は環状凸部。1 and 2 are a sectional view and a plan view showing the conventional structure, FIG. 3 is a sectional view showing the drawbacks of the conventional structure, and FIG. 4 is a sectional view showing the structure of the present invention. -3 is a metal plate, 4 is a case, 5 is a screw, 8 is a hole, 9 is a screw hole, and 10 is an annular convex portion.
Claims (1)
止めし、該ケース内に樹脂を注入して封止する混成集積
回路装置において、前記ケースのねじ穴の周辺に環状の
凸部を形成し、それに対応する金属板の孔を凸部の外周
と密接するよう形成したことを特徴とする混成集積回路
装置。In a hybrid integrated circuit device in which a metal plate with a circuit-forming board fixed to the inside bottom of the case is screwed and sealed by injecting resin into the case, an annular convex portion is formed around the screw hole of the case. A hybrid integrated circuit device characterized in that a hole in a metal plate corresponding to the hole is formed in close contact with the outer periphery of the convex portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18477781U JPS5889989U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18477781U JPS5889989U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5889989U true JPS5889989U (en) | 1983-06-17 |
Family
ID=29985233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18477781U Pending JPS5889989U (en) | 1981-12-11 | 1981-12-11 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5889989U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010151498A (en) * | 2008-12-24 | 2010-07-08 | Nippon Seiki Co Ltd | Indication device |
-
1981
- 1981-12-11 JP JP18477781U patent/JPS5889989U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010151498A (en) * | 2008-12-24 | 2010-07-08 | Nippon Seiki Co Ltd | Indication device |
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