JPS6048243U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6048243U
JPS6048243U JP13926383U JP13926383U JPS6048243U JP S6048243 U JPS6048243 U JP S6048243U JP 13926383 U JP13926383 U JP 13926383U JP 13926383 U JP13926383 U JP 13926383U JP S6048243 U JPS6048243 U JP S6048243U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
recorded
coating
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13926383U
Other languages
Japanese (ja)
Inventor
楠木　弘務
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP13926383U priority Critical patent/JPS6048243U/en
Publication of JPS6048243U publication Critical patent/JPS6048243U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の半導体装置を示す断面図、第２ａ図は
、本考案の一実施例を示す正面図、第２ｂ図は、第２ａ
図に示すものの側面図、第３図は、本考案の他の実施例
を示す断面図である。 ｂ・・・・・・モールドパッケージ（硬質樹脂）、ｅ・
・・・・・樹脂コーティング（樹脂被膜）。FIG. 1 is a cross-sectional view showing a conventional semiconductor device, FIG. 2a is a front view showing an embodiment of the present invention, and FIG. 2b is a cross-sectional view showing a conventional semiconductor device.
FIG. 3 is a side view of what is shown in the figure, and FIG. 3 is a sectional view showing another embodiment of the present invention. b...Mold package (hard resin), e...
...Resin coating (resin film).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 標印後のモールドパッケージの表面に、透明な樹脂によ
るコーティングを施したことを特徴とする、半導体装置
。A semiconductor device characterized by coating the surface of a molded package with a transparent resin after marking.
JP13926383U 1983-09-07 1983-09-07 semiconductor equipment Pending JPS6048243U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13926383U JPS6048243U (en) 1983-09-07 1983-09-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13926383U JPS6048243U (en) 1983-09-07 1983-09-07 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6048243U true JPS6048243U (en) 1985-04-04

Family

ID=30312198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13926383U Pending JPS6048243U (en) 1983-09-07 1983-09-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6048243U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS638159U (en) * 1986-07-03 1988-01-20
JP2013153007A (en) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd Electronic component and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS638159U (en) * 1986-07-03 1988-01-20
JP2013153007A (en) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd Electronic component and method for manufacturing the same

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