JPS6088561U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6088561U JPS6088561U JP18034583U JP18034583U JPS6088561U JP S6088561 U JPS6088561 U JP S6088561U JP 18034583 U JP18034583 U JP 18034583U JP 18034583 U JP18034583 U JP 18034583U JP S6088561 U JPS6088561 U JP S6088561U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- width
- groove
- lead
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来例を示す外形図、第３図は従
来のリード成型方法を示す断面図、第４図ａ、 ｂは本
考案の一実施例を示した外形図である。
１．１１・・・・・・樹脂、２，２２・・・・・・外部
リード、３・・・・・・金型、４４・・・・・・溝。1 and 2 are external views showing a conventional example, FIG. 3 is a sectional view showing a conventional lead molding method, and FIGS. 4a and 4b are external views showing an embodiment of the present invention. 1.11...Resin, 2,22...External lead, 3...Mold, 44...Groove.
Claims (1)
リード厚以上の深さを有する溝が設けられ、前記パッケ
ージから導出された外部リードは″ 前記溝に沿って折
り曲げられ、さらにパッケージ゛ の底面に沿って曲
げ成型されたことを特徴とする半導体装置。The package is provided with a groove having a width slightly larger than the external lead width and a depth greater than the lead thickness. A semiconductor device characterized in that it is bent and formed along the same direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18034583U JPS6088561U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18034583U JPS6088561U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6088561U true JPS6088561U (en) | 1985-06-18 |
Family
ID=30391057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18034583U Pending JPS6088561U (en) | 1983-11-22 | 1983-11-22 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088561U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
| JPS57155758A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
| JPS58184746A (en) * | 1982-04-22 | 1983-10-28 | Toshiba Corp | Package |
-
1983
- 1983-11-22 JP JP18034583U patent/JPS6088561U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
| JPS57155758A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
| JPS58184746A (en) * | 1982-04-22 | 1983-10-28 | Toshiba Corp | Package |
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