JPS55153362A - Chip type semiconductor part - Google Patents

Chip type semiconductor part

Info

Publication number
JPS55153362A
JPS55153362A JP6183879A JP6183879A JPS55153362A JP S55153362 A JPS55153362 A JP S55153362A JP 6183879 A JP6183879 A JP 6183879A JP 6183879 A JP6183879 A JP 6183879A JP S55153362 A JPS55153362 A JP S55153362A
Authority
JP
Japan
Prior art keywords
electrode terminal
wiring board
protruded
printed wiring
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6183879A
Other languages
Japanese (ja)
Inventor
Katsuki Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6183879A priority Critical patent/JPS55153362A/en
Publication of JPS55153362A publication Critical patent/JPS55153362A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable performance of an automatic soldering when attaching the connecting a part to a printed wiring board by connecting the electrode terminal protruded from the body of a moulded part to the side of the body of the part. CONSTITUTION:The electrode terminals 6-8 protruded from a part body 5 with moulded semiconductor are divided longitudinal direction to electrode terminal pieces 6a, 6b, 7a, 7b, 8a and 8b. And among these electrode terminal pieces, 6a- 8a are bent upward along the side of the body 5, 6b-8b are bent downward along the side of the body 5, and they are connected to the notched ridges 5a-5c and 5e etc. which are formed on the upper and the lower surfaces of the body 5 respectively. Upon completion of the above-mentioned composition, the body 5 is temporarily fixed on the printed wiring board, and an automatic soldering can be performed by having them soaked in melted solder and by moving them at the same time.
JP6183879A 1979-05-18 1979-05-18 Chip type semiconductor part Pending JPS55153362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6183879A JPS55153362A (en) 1979-05-18 1979-05-18 Chip type semiconductor part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6183879A JPS55153362A (en) 1979-05-18 1979-05-18 Chip type semiconductor part

Publications (1)

Publication Number Publication Date
JPS55153362A true JPS55153362A (en) 1980-11-29

Family

ID=13182628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6183879A Pending JPS55153362A (en) 1979-05-18 1979-05-18 Chip type semiconductor part

Country Status (1)

Country Link
JP (1) JPS55153362A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114549U (en) * 1980-02-04 1981-09-03
JPS57119548U (en) * 1981-01-16 1982-07-24
JPS58147258U (en) * 1982-03-29 1983-10-03 日本電気ホームエレクトロニクス株式会社 electronic components
JPS5943556A (en) * 1982-09-03 1984-03-10 Matsushita Electric Ind Co Ltd Forming method for end surface electrode
JPS5980955A (en) * 1982-10-29 1984-05-10 Matsushita Electronics Corp Electronic parts device
JPS59128749U (en) * 1983-02-17 1984-08-30 三洋電機株式会社 solar cells
JPS6021548A (en) * 1983-07-15 1985-02-02 Matsushita Electric Ind Co Ltd Chip component
JPS6025155U (en) * 1983-07-25 1985-02-20 日本電気株式会社 Resin-encapsulated semiconductor device
JPS6088561U (en) * 1983-11-22 1985-06-18 日本電気株式会社 semiconductor equipment
US4574297A (en) * 1981-07-15 1986-03-04 Rohm Company Limited Encapsulated semiconductor with terminals having tabs to increase solder wetting
JPS61207043U (en) * 1985-06-18 1986-12-27
JPS62149848U (en) * 1986-03-12 1987-09-22
FR2728726A1 (en) * 1994-12-24 1996-06-28 Telefunken Microelectron MULTIPOLAR ELECTRONIC COMPONENT THAT CAN BE MOUNTED ON A SURFACE
WO2002001635A2 (en) * 2000-06-29 2002-01-03 Robert Bosch Gmbh Electronic component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498168A (en) * 1978-01-20 1979-08-02 Toshiba Corp Thyrister controller

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498168A (en) * 1978-01-20 1979-08-02 Toshiba Corp Thyrister controller

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114549U (en) * 1980-02-04 1981-09-03
JPH025543Y2 (en) * 1980-02-04 1990-02-09
JPS57119548U (en) * 1981-01-16 1982-07-24
JPS6314470Y2 (en) * 1981-01-16 1988-04-22
US4574297A (en) * 1981-07-15 1986-03-04 Rohm Company Limited Encapsulated semiconductor with terminals having tabs to increase solder wetting
JPS58147258U (en) * 1982-03-29 1983-10-03 日本電気ホームエレクトロニクス株式会社 electronic components
JPS5943556A (en) * 1982-09-03 1984-03-10 Matsushita Electric Ind Co Ltd Forming method for end surface electrode
JPS5980955A (en) * 1982-10-29 1984-05-10 Matsushita Electronics Corp Electronic parts device
JPS59128749U (en) * 1983-02-17 1984-08-30 三洋電機株式会社 solar cells
JPS6021548A (en) * 1983-07-15 1985-02-02 Matsushita Electric Ind Co Ltd Chip component
JPH0520885B2 (en) * 1983-07-15 1993-03-22 Matsushita Electric Ind Co Ltd
JPS6025155U (en) * 1983-07-25 1985-02-20 日本電気株式会社 Resin-encapsulated semiconductor device
JPS6088561U (en) * 1983-11-22 1985-06-18 日本電気株式会社 semiconductor equipment
JPS61207043U (en) * 1985-06-18 1986-12-27
JPS62149848U (en) * 1986-03-12 1987-09-22
FR2728726A1 (en) * 1994-12-24 1996-06-28 Telefunken Microelectron MULTIPOLAR ELECTRONIC COMPONENT THAT CAN BE MOUNTED ON A SURFACE
WO2002001635A2 (en) * 2000-06-29 2002-01-03 Robert Bosch Gmbh Electronic component
WO2002001635A3 (en) * 2000-06-29 2002-06-27 Bosch Gmbh Robert Electronic component

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