JPS6489550A - Ic socket - Google Patents

Ic socket

Info

Publication number
JPS6489550A
JPS6489550A JP24831287A JP24831287A JPS6489550A JP S6489550 A JPS6489550 A JP S6489550A JP 24831287 A JP24831287 A JP 24831287A JP 24831287 A JP24831287 A JP 24831287A JP S6489550 A JPS6489550 A JP S6489550A
Authority
JP
Japan
Prior art keywords
socket
frame
lid
leads
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24831287A
Other languages
Japanese (ja)
Inventor
Koji Nishibayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24831287A priority Critical patent/JPS6489550A/en
Publication of JPS6489550A publication Critical patent/JPS6489550A/en
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

PURPOSE:To solder socket terminals onto the same pattern on a PC board as for the direct soldering of ICs by a socket structure in which, under a socket frame, each contact extends to be a terminal adapted for direct soldering to the printed pattern on a flat-pack IC mounting PC board, and the connecting structure has a size within the IC mounting area. CONSTITUTION:Leads 10 of a flat-pack IC 9 are placed on the corresponding contacts 2a planted in a socket frame 1, and the frame is overlaid with a lid 3. This socket assembly is placed on a PC board 7 which has a printed pattern 8 adapted to the lead arrangement of the IC 9. The frame 1 and lid 3 have holes 4 at their four corners which are within the mounting area of the IC 9. Bolts 5 are put through the holes 4 and holes, and fixed with nuts 6. The leads 10 are pressed against the contacts 2a by the lid 3. This brings the leads into firm contact with the contacts and, at the same time, connects the socket terminals 2 to the printed pattern 8.
JP24831287A 1987-09-30 1987-09-30 Ic socket Pending JPS6489550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24831287A JPS6489550A (en) 1987-09-30 1987-09-30 Ic socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24831287A JPS6489550A (en) 1987-09-30 1987-09-30 Ic socket

Publications (1)

Publication Number Publication Date
JPS6489550A true JPS6489550A (en) 1989-04-04

Family

ID=17176202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24831287A Pending JPS6489550A (en) 1987-09-30 1987-09-30 Ic socket

Country Status (1)

Country Link
JP (1) JPS6489550A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242774A (en) * 1992-03-27 1993-09-07 Xerox Corporation Photoconductive imaging members with fluorinated polycarbonates
JP2016009653A (en) * 2014-06-26 2016-01-18 Ｎｅｃスペーステクノロジー株式会社 IC socket

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242774A (en) * 1992-03-27 1993-09-07 Xerox Corporation Photoconductive imaging members with fluorinated polycarbonates
JP2016009653A (en) * 2014-06-26 2016-01-18 Ｎｅｃスペーステクノロジー株式会社 IC socket

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