JPS5980955A - Electronic parts device - Google Patents
Electronic parts deviceInfo
- Publication number
- JPS5980955A JPS5980955A JP19156082A JP19156082A JPS5980955A JP S5980955 A JPS5980955 A JP S5980955A JP 19156082 A JP19156082 A JP 19156082A JP 19156082 A JP19156082 A JP 19156082A JP S5980955 A JPS5980955 A JP S5980955A
- Authority
- JP
- Japan
- Prior art keywords
- external conductor
- casing
- concavity
- envelope
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品装置、とくに、外囲器から同器外へ延
びる外部導体を有する電子部品装置における外囲器と外
部導体との構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component device, and more particularly to a structure of an envelope and an outer conductor in an electronic component device having an outer conductor extending from the envelope to the outside of the device. be.
従来例の構成とその問題点
電子部品装置、たとえば半導体装置は、通常、機能回路
要素を樹脂外囲器内に封入しており、外囲器からは外部
導体のみを器外に出している。第１図ならびに第２図は
、かかる半導体装置の外形構造を表わした要部斜視図な
らびに要部断面図である。これらの図面からもわかるよ
うに、従来の半導体装置は樹脂外囲器１から外部へ延び
る外部導体２が同外囲器１の側壁面に支持されて片持状
態で突出した構造になっておシ、外部導体２が外力で変
形し易い。また、最近では、半導体装置の多機能・高密
度化にともなって、外部導体の径小化ならびに外部導体
数の増加傾向が著しく、このため、外部導体２の変形、
相互の短絡などの対応策が求められ、その取り扱いには
一段と細心の配慮が必要であった。2. Description of the Related Art Conventional Structures and Problems Electronic component devices, such as semiconductor devices, usually have functional circuit elements enclosed in a resin envelope, with only the external conductor coming out of the envelope. FIG. 1 and FIG. 2 are a perspective view and a sectional view of a main part showing the external structure of such a semiconductor device. As can be seen from these drawings, the conventional semiconductor device has a structure in which an external conductor 2 extending outward from a resin envelope 1 is supported by the side wall surface of the envelope 1 and protrudes in a cantilevered manner. B. The outer conductor 2 is easily deformed by external force. In addition, in recent years, as semiconductor devices have become more multi-functional and more dense, there has been a remarkable tendency to reduce the diameter of outer conductors and increase the number of outer conductors.
Countermeasures such as mutual short-circuiting were required, and even more careful consideration was needed in handling them.
発明の目的
本発明は上述のような従来装置にみられた問題点を解消
した電子部品装置を提供するものである。OBJECTS OF THE INVENTION The present invention provides an electronic component device that solves the problems seen in conventional devices as described above.
発明の構成
本発明は、要約して、外囲器から同器外へ延びる外部導
体を、前記外囲器の外壁に設けられた窪みに沿って配設
した構成の電子部品装置であり、これによれば、外部導
体が外囲器の窪みの位置で雀えられ、外力に対して、外
部導体を変形し難い構造にすることができる。Summary of the Invention The present invention is an electronic component device having a configuration in which an external conductor extending from an envelope to the outside of the envelope is disposed along a recess provided in an outer wall of the envelope. According to this method, the outer conductor is suspended at the position of the recess of the envelope, and the outer conductor can be structured to be difficult to deform due to external force.
実施例の説明
第３図ないし第６図は本発明実施例装置の要部を示す部
分図、斜視図および断面図であ丞。この装置では、第朶
図で示されるように、樹脂外囲器１の外壁面に窪み３が
設けられている。この窪み３は、外部導体２が外囲器１
から外方に突出する位置から同外囲器１の下面に向かっ
て、外部導体２の幅で設けられている。また、この窪み
３の深さは、外部導体２の厚み側面を支えることができ
れば、本質的には制限されないが、好ましくは外部導体
２の厚み以上であって、同外部導体２を折り曲げて窪み
３の中に沿って配設したとき、同外部導体２の外面が外
囲器、１の外壁平面と同じか、あるいは同一面より沈む
位置になるように深い目に設けられるとよい。このよう
な窪み３を設けることにより、外部導体２はこの窪みの
中に沈め込むことができ、同外部導体２が同窪み３の中
で安定に支えられ、外力を受は難い構造になる。第４図
は外部導体２を外囲器１の側壁面に設けた窪み３に沿っ
て折り曲げ、さらに、外囲器１の下面に平行する位置で
直角に折り曲げて外方に引き出したものであり、第５図
はこの実施例装置の要部断面を示しだものである。外囲
器１の外壁に、上述のような窪み３を設けるだめの加工
法は、同外囲器１を成型する工程で、所望の金型を用い
れば容易に実現できることである。DESCRIPTION OF EMBODIMENTS FIGS. 3 to 6 are partial views, perspective views, and sectional views showing essential parts of an apparatus according to an embodiment of the present invention. In this device, as shown in the diagram, a depression 3 is provided in the outer wall surface of the resin envelope 1. This recess 3 is formed when the outer conductor 2 is connected to the envelope 1.
The width of the outer conductor 2 extends from a position protruding outward from the outer conductor 1 toward the lower surface of the envelope 1 . The depth of the recess 3 is not essentially limited as long as it can support the thickness side of the outer conductor 2, but it is preferably at least the thickness of the outer conductor 2, and the depth of the recess 3 is not limited to the depth of the outer conductor 2. When the external conductor 2 is disposed along the inside of the envelope 1, the external conductor 2 is preferably provided with a deep groove so that the outer surface of the external conductor 2 is at the same level as the outer wall plane of the envelope 1, or at a position sunk below the same plane. By providing such a recess 3, the outer conductor 2 can be sunk into the recess, and the outer conductor 2 is stably supported within the recess 3, resulting in a structure that is difficult to receive external forces. In Figure 4, the outer conductor 2 is bent along the recess 3 provided on the side wall surface of the envelope 1, then bent at a right angle at a position parallel to the lower surface of the envelope 1, and pulled out. , and FIG. 5 shows a cross section of the main part of this embodiment of the apparatus. The method of forming the above-mentioned depressions 3 on the outer wall of the envelope 1 can be easily realized by using a desired mold in the process of molding the envelope 1.
発明の効果
以上に実施例装置で詳しくのべたように、本発明によれ
ば、外囲器から同器外へ延びる外部導体を、前記外囲器
の外壁に設けられた窪みに沿って配設した構造になすこ
とにより、外部導体が外囲器壁の窪み内で支えられて、
外力に対する変形を起しにくいように補強される。また
、窪みの中に外部導体を沈めて配設したことにより、こ
の部分での短絡が生じにくい構造になり、この電子部品
装置を電子機器に組み込むときの取り扱い上での容易性
は格段に向上し、その波及効果は大である。As described in detail in the embodiment device above the effects of the invention, according to the present invention, the external conductor extending from the envelope to the outside of the envelope is arranged along the recess provided in the outer wall of the envelope. With this structure, the outer conductor is supported within the recess of the envelope wall,
Reinforced to prevent deformation due to external forces. In addition, by placing the external conductor in the recess, short circuits are less likely to occur in this part, making it much easier to handle when incorporating this electronic component device into electronic equipment. However, the ripple effect is huge.
第１図および第２図は従来例装置の要部斜視図および同
断面図、第３図ないし第５図は本発明実施例装置の要部
部分図、斜視図および断面図である。
１・・・・・・外囲器、２・・・・・・外部導体、３・
・・・・・窪み。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第
１ 囚
第４図
第５図1 and 2 are a perspective view and a cross-sectional view of a main part of a conventional device, and FIGS. 3 to 5 are a partial view, a perspective view, and a cross-sectional view of a main part of a device according to an embodiment of the present invention. 1...Envelope, 2...External conductor, 3.
...a hollow. Name of agent: Patent attorney Toshio Nakao and 1 other person
1 Prisoner Figure 4 Figure 5
Claims (1)
導体を有し、前記外囲器の外壁に設けられた窪みに沿っ
て前記外部導体を配設したことを特徴とする電子部品装
置。An electronic component comprising an envelope surrounding a functional circuit element and an outer conductor extending outside the envelope, the outer conductor being arranged along a recess provided in an outer wall of the envelope. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19156082A JPS5980955A (en) | 1982-10-29 | 1982-10-29 | Electronic parts device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19156082A JPS5980955A (en) | 1982-10-29 | 1982-10-29 | Electronic parts device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5980955A true JPS5980955A (en) | 1984-05-10 |
Family
ID=16276698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19156082A Pending JPS5980955A (en) | 1982-10-29 | 1982-10-29 | Electronic parts device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5980955A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
| JPS57155758A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
-
1982
- 1982-10-29 JP JP19156082A patent/JPS5980955A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
| JPS57155758A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
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