JP2633568B2 - Structure where electronic circuits are arranged - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION A structure on which an electronic circuit of the present invention is arranged will be described in accordance with the following items.

A. Industrial applications B. Summary of the invention C. Background art D. Problems to be solved by the invention E. Means for solving the problems F. Embodiment a. Structure in which electronic circuits are arranged [FIG. 1, FIG.
Figure] b. Manufacturing process of structure in which electronic circuit is arranged [FIG. 3] G. Effect of the Invention (A. Industrial Application Field) The present invention relates to a structure in which a new electronic circuit is arranged. Specifically, a so-called chip-type electronic circuit, that is, an electronic circuit including an electronic component having a connection terminal on the surface and a substantially foil-shaped conductor connected to the connection terminal of the electronic component and forming a predetermined wiring pattern is arranged. It is possible to provide an electronic circuit necessary for a predetermined electronic device or the like without using a special substrate member such as an insulating laminated board, and to improve a circuit mounting density. It is an object of the present invention to provide a structure in which a new electronic circuit is arranged.

(B. Summary of the Invention) A structure in which an electronic circuit of the present invention is arranged includes an electronic component having connection terminals on its surface and a conductor forming a predetermined wiring pattern, and a plurality of walls of a synthetic resin housing. A conductor fixed to the surface of the wall of the housing, and a first electronic component embedded in the wall and having its connection terminal soldered to a predetermined location on one surface of the conductor. By using a component group and a second electronic component group whose connection terminal is soldered to a predetermined position on the other surface of the conductor and mounted on the inner surface of the housing, a special substrate member is not used. However, it is also possible to provide necessary circuits and improve the packaging density of the circuits.

(C. Background Art) A structure in which electronic circuits are arranged is generally formed by connecting various electronic components with conductors.

In a structure in which today's electronic circuits are arranged, the conductor is formed on a predetermined insulating surface, for example, a surface of a so-called laminated board in a state where a predetermined wiring pattern is formed, and at the same time, a predetermined wiring pattern is formed. Is generally configured as a circuit board by mounting a predetermined electronic component at the location.

(D. Problems to be Solved by the Invention) By the way, such a circuit board has an advantage that its electronic circuit can be handled independently of other components provided in an electronic device or the like. On the other hand, it is necessary to hold the circuit board on a suitable support member, for example, a chassis or a rack for holding the board, or a housing wall, so that it is necessary to use some kind of holding means for this holding. There is a problem that the structure of the electronic components becomes complicated, the shape becomes large, and the cost increases.

Since the above-described holding of the circuit board is performed by screwing the board to a chassis or a housing wall or by engaging a side edge of the board with an engaging portion such as a rack, the screw is inserted. It is necessary to provide a space on the substrate for forming a hole for making
There is a problem that this space reduces the mounting density on the circuit board.

Furthermore, since electronic devices and the like have recently been increasingly miniaturized, the space inside the housing has been considerably reduced.
Therefore, it has become very difficult to design the layout of the circuit boards.

The electronic components mounted on the circuit board are usually provided on the board in a state where no means for protecting against the environment, that is, no means for protecting against contact of heat, dust, or foreign matter, is provided on the board. In addition, there is a problem that the reliability of environmental resistance characteristics and its operation is likely to be low. Also, if a protective member is provided on the circuit board to cover the circuit forming surface, the shape of the circuit board becomes extremely large, and the weight becomes large. Another problem arises.

And the circuit board, due to restrictions in its manufacturing process,
Since it is extremely difficult to form an electronic circuit three-dimensionally, that is, it is extremely difficult to continuously form a curved surface, a surface having irregularities, or a plurality of planes having different directions, it is inevitably easily enlarged in a planar manner, In order to reduce the planar shape, there is a problem that it is necessary to divide the circuit board into a plurality of circuit boards.

(E. Means for Solving the Problems) Therefore, in order to solve the various problems described above, the structure in which the electronic circuit of the present invention is arranged is an electronic component having connection terminals provided on the surface thereof. A conductor that is arranged over a plurality of walls of a synthetic resin housing and is fixed to the surface of the wall of the housing; and a conductor that is embedded in the wall and embedded in the wall. A first electronic component group whose connection terminal is soldered to a predetermined position on one surface;
The connection terminal is soldered to a predetermined location on the other surface of the conductor, and the second electronic component group is mounted on the inner surface of the housing.

Therefore, according to the structure in which the electronic circuit of the present invention is arranged, the conductors and electronic components constituting the structure in which the electronic circuit is arranged are supported by a predetermined housing, so that a special substrate member is not used. In addition, a circuit necessary for an electronic device or the like can be provided, and since the supporting of the electronic circuit on the housing is performed in a molding process of the housing, there is no need to perform a special supporting operation. There is no need for a special support means for supporting the housing on the housing, and the form of the electronic circuit can be freely selected from among the forms of the outer surface of the housing.

(F. Example) Hereinafter, details of the structure in which the electronic circuit of the present invention is arranged will be described with reference to the example shown in the accompanying drawings.

The embodiment shown in the drawings is a case where the electronic circuit is provided in a state of being embedded in the housing wall.

(A. Structure of Structure Having Electronic Circuit Arranged) [FIGS. 1 and 2] Reference numeral 1 denotes a structure having an electronic circuit having a predetermined operation function, and the structure has connection terminals. It comprises various predetermined electronic components located on the surface of the case, conductors to which connection terminals of the electronic components are connected to form a predetermined wiring pattern, and a housing wall.

Reference numeral 2 denotes a housing of the electronic device, which is formed of a synthetic resin. Then, two wall portions 5 and 6 of one of the two partial housings 3 and 4 constituting the housing 2, for example, a corner portion where the back wall and the bottom wall are continuous, that is, with another predetermined mechanism. The electronic circuit is arranged in a portion where the interference is relatively small.

Are conductors formed in a substantially foil shape from a conductive material. These conductors 7, 7,... Have a predetermined wiring pattern and have the two wall portions 5, 7,.
6 are fixed to the surfaces 5a and 6a.

, And 8 ′, 8 ′,... Are leadless type electronic components, so-called chip components, and a molded case 9, in which a predetermined electronic device chip is enclosed.
, 9 ′, 9 ′,..., A plurality of connection terminals 10, 10,.
.. Are formed.

And these electronic components 8, 8, ... and 8 ',
, Which form one group of 8 ′,..., Are buried at positions near the surfaces 5a, 6a of the walls 5, 6, and their connection terminals 10, 10,. Are the conductors 7, 7,.
..One surface 7a, 7a,..., That is, surface 5a, 6a
Are soldered to predetermined portions of the surface that is not exposed to the other, and electronic components 8 ', 8',.
Are connection terminals 10 ', 10',... Are conductors 7, 7,.
.. Are soldered to predetermined portions of the other surfaces 7b, 7b,..., That is, the surfaces exposed to the surfaces 5a, 6a of the walls 5, 6.

Although not shown, a connection means for connecting the structure 1 and another circuit is provided at a connection end of the conductors 7, 7,....

(B. Manufacturing process of the structure on which the electronic circuit is arranged) [Third
FIG. 3 shows an example of a manufacturing process of the above-described structure 1 (A).
From (F) to (F), and the manufacturing process of the structure 1 in which the electronic circuits are arranged in accordance with (A) to (F) will be described below.

(A) First, the conductor 7 is provided on one surface of an appropriate temporary substrate 11.
The conductive foil 12 which becomes the material of 7, ... is provided. This conductive foil
12 may be a pre-plated so-called electrolytic copper foil or rolled copper foil or the like may be attached to the temporary substrate 11, or the temporary substrate 11
May be provided by direct plating.

The material of the temporary substrate 11 is not particularly limited as long as it has a certain degree of flexibility.
It is desirable to use a material that can be relatively easily peeled off.

(B) Next, the conductive foil 12 is subjected to an etching process while leaving necessary portions. That is, for example, an etching resist for forming the predetermined wiring pattern is provided on the conductive foil 12, and in that state, the conductive foil 12 is etched to dissolve portions of the conductive foil 12 other than the portion where the etching resist is provided. Then, the etching resist is removed.

Thus, the conductors 7, 7,... Having a predetermined wiring pattern are formed on the temporary substrate 11.

(C) Then, the conductors 7, 7,.
The electronic components 8, 8,... Are mounted on one surface 7a. This mounting is a connection terminal for the electronic components 8, 8,.
Are soldered to predetermined portions of the conductors 7, 7,....

Thus, a circuit 13 using the temporary substrate 11 as a substrate is configured.

(D) Then, the circuit 13 configured as described above is set in predetermined molding dies 14 and 15. That is, 14 and 15 are a pair of molds for molding the one partial housing 3 with synthetic resin, and 16 is an abutting surface 14 of these molding dies 14 and 15.
a, 15a are cavities defined by abutting each other, that is, a space having the same shape as the partial housing 3, and the circuit board 13 includes a temporary substrate 11 and a pair of molding dies 1
It is set in a state in which it is exactly in contact with the butting surface 14a of one of the four 14 and 15. Therefore, in this state, the conductors 7, 7, ... of the circuit 13 are located along one inner surface in the thickness direction of the cavity 16, and the electronic components 8, 8, ... project from the inner surface. Is located.

(E) Then, a predetermined molten resin is injected into the cavity 16. Thereby, the partial housing 3 is formed,
The electronic components 8, 8,... Are embedded in the partial housing 3, and the conductors 7, 7,... Are positioned on the surfaces 5a, 6a of the walls 5, 6 of the partial housing 3. Will be.

If there is a possibility that the electronic components 8, 8,... May come off the temporary substrate 11 depending on the magnitude of the injection pressure of the molten resin injected into the cavity 16, the circuit 13 is used for molding. Before setting in the molds 14 and 15, for example, a suitable cream-like damper material 17 is applied to the temporary substrate 11 so that the electronic components 8, 8,. 17 may be solidified or semi-solidified.

(F) Then, the partial housing 3 thus formed is removed from the molding dies 14 and 15, and the temporary substrate 11 is peeled off.

Thereby, the other surfaces 7b, 7b of the conductors 7, 7,.
Are exposed on the surfaces 5a and 6a of the partial housing 3.

Thus, the other surfaces 7b, 7b,... Of the conductors 7, 7,.
Attach the electronic components 8 ', 8',... To predetermined locations.

As a result, the structure 1 on which the electronic circuit is arranged is completed.

(G. Effects of the Invention) As is clear from the above description, the structure on which the electronic circuit of the present invention is arranged is composed of an electronic component having connection terminals on the surface and a conductor forming a predetermined wiring pattern. And a conductor that is disposed across a plurality of walls of the synthetic resin housing and is fixed to the surface of the wall of the housing, and is embedded in the wall and is disposed at a predetermined position on one surface of the conductor. A first electronic component group to which connection terminals are soldered, and a second electronic component group to which the connection terminals are soldered to predetermined positions on the other surface of the conductor and are mounted on the inner surface of the housing It is made to become.

Therefore, according to the structure in which the electronic circuit of the present invention is arranged, the conductors and electronic components constituting the structure in which the electronic circuit is arranged are supported by a predetermined housing, so that a special substrate member is not used. In addition, a circuit necessary for an electronic device or the like can be provided, and since the supporting of the electronic circuit on the housing is performed in a molding process of the housing, there is no need to perform a special supporting operation. There is no need for special support means for supporting the housing on the housing.

In addition, since no special supporting means for supporting the electronic circuit on the housing is required, the circuit can be arranged over the entire predetermined portion of the housing, so that the mounting density can be increased.

According to the structure in which the electronic circuit of the present invention is arranged, the conductor can be arranged in a state of extending in the three-dimensional direction, so that the form of the electronic circuit is not limited to a planar one. It can be freely selected in the form of the outer surface of the housing. Therefore, an electronic circuit can be provided on a bent surface or a surface having irregularities.

[Brief description of the drawings]

The drawings show an embodiment of a structure in which the electronic circuit of the present invention is arranged. FIG. 1 is a cross-sectional view showing a part of a casing, and FIG. 2 is a sectional view showing a part of a casing wall. FIG. 3 is a process diagram showing the manufacturing process of the structure on which the electronic circuit is arranged in order from (A) to (F). DESCRIPTION OF SYMBOLS 1 ... structure, 2 ... housing, 5, 6 ... wall, 5a, 6a ...
... wall surface, 7 ... conductor, 7a ... one side of conductor, 7b
... the other surface of the conductor, 8 ... the first electronic component, 8 '...
Second electronic component, 10, 10 '... connection terminal, 13 ... electronic circuit

Claims (1)

(57) [Claims] An electronic component having a connection terminal provided on a surface thereof and a conductor forming a predetermined wiring pattern, the electronic component being disposed over a plurality of walls of a synthetic resin housing, and a surface of the wall of the housing. A first electronic component group embedded in the wall and having its connection terminal soldered to a predetermined location on one surface of the conductor; and a first electronic component group embedded at a predetermined location on the other surface of the conductor. A second electronic component group to which the connection terminals are soldered and which is mounted on the inner surface of the housing;