JPS649695A - Electronic circuit - Google Patents

Electronic circuit

Info

Publication number
JPS649695A
JPS649695A JP16574487A JP16574487A JPS649695A JP S649695 A JPS649695 A JP S649695A JP 16574487 A JP16574487 A JP 16574487A JP 16574487 A JP16574487 A JP 16574487A JP S649695 A JPS649695 A JP S649695A
Authority
JP
Japan
Prior art keywords
circuit
conductors
electronic
partial case
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16574487A
Other languages
Japanese (ja)
Other versions
JP2633568B2 (en
Inventor
Yasuhiro Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62165744A priority Critical patent/JP2633568B2/en
Publication of JPS649695A publication Critical patent/JPS649695A/en
Application granted granted Critical
Publication of JP2633568B2 publication Critical patent/JP2633568B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to provide a necessary circuit without using a special board member and to improve the environmental resistance and packaging density of the circuit by a method wherein, in an electronic circuit, the circuit is integrally formed with a structure made of a synthetic resin which is necessarily provided in an electronic equipment or the like. CONSTITUTION:A predetermined molten resin is injected into a cavity 16 to form a partial case 3, in which electronic parts 8, 8... are buried and positioned, and conductors 7, 7... are positioned on the inner surfaces 5a, 6a of the wall sections 5, 6 of the partial case 3. And the molded partial case 3 is taken out from metal molds 14, 15 and a temporary board 11 is peeled off. By this, the other surfaces 7b, 7b... of the conductors 7, 7... are exposed in the inner surfaces 5a, 6a. And electronic parts 8', 8'... are mounted on the predetermined places of the other surfaces 7b, 7b... of the conductors 7, 7.... With this, an electronic circuit 1 is completed, and the packaging density can be increased.
JP62165744A 1987-07-02 1987-07-02 Structure where electronic circuits are arranged Expired - Fee Related JP2633568B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62165744A JP2633568B2 (en) 1987-07-02 1987-07-02 Structure where electronic circuits are arranged

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62165744A JP2633568B2 (en) 1987-07-02 1987-07-02 Structure where electronic circuits are arranged

Publications (2)

Publication Number Publication Date
JPS649695A true JPS649695A (en) 1989-01-12
JP2633568B2 JP2633568B2 (en) 1997-07-23

Family

ID=15818253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62165744A Expired - Fee Related JP2633568B2 (en) 1987-07-02 1987-07-02 Structure where electronic circuits are arranged

Country Status (1)

Country Link
JP (1) JP2633568B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004016055A1 (en) * 2002-08-05 2004-02-19 Koninklijke Philips Electronics N.V. An electronic product, a body and a method of manufacturing
JP2010272756A (en) * 2009-05-22 2010-12-02 Omron Corp Apparatus for mounting electronic component and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140492U (en) * 1983-03-10 1984-09-19 三菱電機株式会社 Electronics
JPS6190331U (en) * 1984-11-19 1986-06-12

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140492U (en) * 1983-03-10 1984-09-19 三菱電機株式会社 Electronics
JPS6190331U (en) * 1984-11-19 1986-06-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004016055A1 (en) * 2002-08-05 2004-02-19 Koninklijke Philips Electronics N.V. An electronic product, a body and a method of manufacturing
JP2010272756A (en) * 2009-05-22 2010-12-02 Omron Corp Apparatus for mounting electronic component and method of manufacturing the same

Also Published As

Publication number Publication date
JP2633568B2 (en) 1997-07-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees