JPS59140492U - Electronics - Google Patents
ElectronicsInfo
- Publication number
- JPS59140492U JPS59140492U JP3426883U JP3426883U JPS59140492U JP S59140492 U JPS59140492 U JP S59140492U JP 3426883 U JP3426883 U JP 3426883U JP 3426883 U JP3426883 U JP 3426883U JP S59140492 U JPS59140492 U JP S59140492U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- components
- electronic device
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の電子機器を示す概略断面図、第2図はこ
の考案による電子機器を示す概略断面図であり、1はケ
ース、2はプリント基板、3は冷却を必要とする部品、
5は一般の部品、6はカバー、7はパラフィンである。
なお、図中同一あるいは相当部分には同一符号を付して
示しである。FIG. 1 is a schematic sectional view showing a conventional electronic device, and FIG. 2 is a schematic sectional view showing an electronic device according to this invention, in which 1 is a case, 2 is a printed circuit board, 3 is a component that requires cooling,
5 is a general part, 6 is a cover, and 7 is paraffin. Note that the same or equivalent parts in the figures are indicated by the same reference numerals.
Claims (1)
内に収納した電子機器において、上記プリント基板の一
方の面に冷却を必要とする部品を主としして配置し、反
対面には主として一般の部品を配置し、上記プリント基
板の冷却を必要とする部品の取付は面とケース間にパラ
フィン(炭化水素混合物)を充鎮したことを特徴とする
電子機器。In an electronic device in which a printed circuit board with components that require cooling mounted is housed in a case, the components requiring cooling are mainly arranged on one side of the printed circuit board, and the general components are mainly arranged on the other side. An electronic device characterized in that parts are arranged and paraffin (hydrocarbon mixture) is filled between the surface and the case for mounting the parts that require cooling of the printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3426883U JPS59140492U (en) | 1983-03-10 | 1983-03-10 | Electronics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3426883U JPS59140492U (en) | 1983-03-10 | 1983-03-10 | Electronics |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59140492U true JPS59140492U (en) | 1984-09-19 |
Family
ID=30165034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3426883U Pending JPS59140492U (en) | 1983-03-10 | 1983-03-10 | Electronics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59140492U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS649695A (en) * | 1987-07-02 | 1989-01-12 | Sony Corp | Electronic circuit |
JP2001210985A (en) * | 2000-01-26 | 2001-08-03 | Denso Corp | Layout method of elements, circuit board, and housing |
JP2012099612A (en) * | 2010-11-01 | 2012-05-24 | Denso Corp | Semiconductor device |
-
1983
- 1983-03-10 JP JP3426883U patent/JPS59140492U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS649695A (en) * | 1987-07-02 | 1989-01-12 | Sony Corp | Electronic circuit |
JP2001210985A (en) * | 2000-01-26 | 2001-08-03 | Denso Corp | Layout method of elements, circuit board, and housing |
JP2012099612A (en) * | 2010-11-01 | 2012-05-24 | Denso Corp | Semiconductor device |
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