JPS58105166U - double-sided printed wiring board - Google Patents
double-sided printed wiring boardInfo
- Publication number
- JPS58105166U JPS58105166U JP292282U JP292282U JPS58105166U JP S58105166 U JPS58105166 U JP S58105166U JP 292282 U JP292282 U JP 292282U JP 292282 U JP292282 U JP 292282U JP S58105166 U JPS58105166 U JP S58105166U
- Authority
- JP
- Japan
- Prior art keywords
- double
- wiring board
- printed wiring
- sided printed
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図aは本考案の一実施例になる両面プリント配線板
モデルの表面平面図であり、第1図すはその裏面平面図
、第2図は比較例になる両面プリント配線板モデルの裏
面平面図、第3図は実施例モデルおよび比較例モデルの
両者について、反りの発生を調べた試験結果を示す線図
である。
1・・・絶縁性中間層基材、2・・・正規の表面側回路
パターンモデル、3・・・正規の裏面側回路パターンモ
デル、4・・・捨回路パターンモデル。Fig. 1a is a front view of a double-sided printed wiring board model that is an embodiment of the present invention, Fig. 1 is a plan view of its back side, and Fig. 2 is a back side of a double-sided printed wiring board model that is a comparative example. The plan view and FIG. 3 are diagrams showing the test results of examining the occurrence of warpage for both the example model and the comparative example model. DESCRIPTION OF SYMBOLS 1... Insulating intermediate layer base material, 2... Regular front side circuit pattern model, 3... Regular back side circuit pattern model, 4... Discarded circuit pattern model.
Claims (1)
成した両面プリント配線板において、正規の回路パター
ン以外に、表面側および裏面側の銅箔残存率をバランス
させるために配線機能をもたない捨回路パターンを形成
したことを特徴とする両面プリント配線板。In a double-sided printed wiring board in which a copper foil circuit pattern is formed on both sides of an insulating intermediate layer base material, in addition to the regular circuit pattern, it has a wiring function to balance the copper foil residual rate on the front and back sides. A double-sided printed wiring board characterized in that a double-sided printed wiring board is formed with no discarded circuit pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP292282U JPS58105166U (en) | 1982-01-13 | 1982-01-13 | double-sided printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP292282U JPS58105166U (en) | 1982-01-13 | 1982-01-13 | double-sided printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58105166U true JPS58105166U (en) | 1983-07-18 |
Family
ID=30015873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP292282U Pending JPS58105166U (en) | 1982-01-13 | 1982-01-13 | double-sided printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58105166U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6333898A (en) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | Manufacture of electromagnetic shielded double-sided printed circuit board |
JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
JP2015147912A (en) * | 2014-02-10 | 2015-08-20 | 日立化成株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
-
1982
- 1982-01-13 JP JP292282U patent/JPS58105166U/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6333898A (en) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | Manufacture of electromagnetic shielded double-sided printed circuit board |
JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
JPH09107159A (en) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | Circuit board and method of manufacture |
JP2015147912A (en) * | 2014-02-10 | 2015-08-20 | 日立化成株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
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