JPS58138365U - Dummy pattern for reinforcing flexible printed circuits - Google Patents

Dummy pattern for reinforcing flexible printed circuits

Info

Publication number
JPS58138365U
JPS58138365U JP3511482U JP3511482U JPS58138365U JP S58138365 U JPS58138365 U JP S58138365U JP 3511482 U JP3511482 U JP 3511482U JP 3511482 U JP3511482 U JP 3511482U JP S58138365 U JPS58138365 U JP S58138365U
Authority
JP
Japan
Prior art keywords
flexible printed
dummy pattern
printed circuits
reinforcing flexible
reinforcing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3511482U
Other languages
Japanese (ja)
Inventor
吉本　光雄
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP3511482U priority Critical patent/JPS58138365U/en
Publication of JPS58138365U publication Critical patent/JPS58138365U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のＦＰＣの構造の一部を示す平面図及び側
面図、第２図は本考案によるＦＰＣの一実施例を示す平
面図及び側面図である。 １・・・ベースフィルム、２・・・接着剤、３・・・カ
バーフィルム、４・・・接続パッド、５・・・パターン
、６・・・ダミーパッド、７・・・補強パターン。FIG. 1 is a plan view and side view showing a part of the structure of a conventional FPC, and FIG. 2 is a plan view and side view showing an embodiment of the FPC according to the present invention. DESCRIPTION OF SYMBOLS 1... Base film, 2... Adhesive, 3... Cover film, 4... Connection pad, 5... Pattern, 6... Dummy pad, 7... Reinforcement pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フレキシブルプリントサーキットにおいて、導体パター
ン以外のダミーパターンに基板との接続用のダミーパッ
ドを設けた事を特徴とするフレキシブルプリントサーキ
ットの補強用ダミーパターン。A dummy pattern for reinforcing a flexible printed circuit, characterized in that a dummy pattern other than the conductor pattern is provided with a dummy pad for connection to a board.
JP3511482U 1982-03-15 1982-03-15 Dummy pattern for reinforcing flexible printed circuits Pending JPS58138365U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3511482U JPS58138365U (en) 1982-03-15 1982-03-15 Dummy pattern for reinforcing flexible printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3511482U JPS58138365U (en) 1982-03-15 1982-03-15 Dummy pattern for reinforcing flexible printed circuits

Publications (1)

Publication Number Publication Date
JPS58138365U true JPS58138365U (en) 1983-09-17

Family

ID=30046596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3511482U Pending JPS58138365U (en) 1982-03-15 1982-03-15 Dummy pattern for reinforcing flexible printed circuits

Country Status (1)

Country Link
JP (1) JPS58138365U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287471U (en) * 1985-11-20 1987-06-04
JPS63160214A (en) * 1986-12-24 1988-07-04 Olympus Optical Co Ltd Printed coil
JPS6428621A (en) * 1987-07-24 1989-01-31 Hitachi Ltd Wiring board
JP2005183740A (en) * 2003-12-19 2005-07-07 Mitsui Mining & Smelting Co Ltd Printed wiring board and semiconductor device
JP2013045956A (en) * 2011-08-25 2013-03-04 Kyocera Corp Wiring board and input device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287471U (en) * 1985-11-20 1987-06-04
JPS63160214A (en) * 1986-12-24 1988-07-04 Olympus Optical Co Ltd Printed coil
JPS6428621A (en) * 1987-07-24 1989-01-31 Hitachi Ltd Wiring board
JP2005183740A (en) * 2003-12-19 2005-07-07 Mitsui Mining & Smelting Co Ltd Printed wiring board and semiconductor device
JP2013045956A (en) * 2011-08-25 2013-03-04 Kyocera Corp Wiring board and input device

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