JPS59152769U - Substrate for additive printed wiring board - Google Patents

Substrate for additive printed wiring board

Info

Publication number
JPS59152769U
JPS59152769U JP4731083U JP4731083U JPS59152769U JP S59152769 U JPS59152769 U JP S59152769U JP 4731083 U JP4731083 U JP 4731083U JP 4731083 U JP4731083 U JP 4731083U JP S59152769 U JPS59152769 U JP S59152769U
Authority
JP
Japan
Prior art keywords
substrate
wiring board
printed wiring
additive printed
additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4731083U
Other languages
Japanese (ja)
Inventor
宏 高橋
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to JP4731083U priority Critical patent/JPS59152769U/en
Publication of JPS59152769U publication Critical patent/JPS59152769U/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示す断面図である。 符号の説明、１・・・・・・合成樹脂絶縁基板、２・・
・・・・紫外線吸収剤含有接着剤。The drawing is a sectional view showing an embodiment of the present invention. Explanation of symbols, 1...Synthetic resin insulating substrate, 2...
...Adhesive containing ultraviolet absorber.

Claims (1)

【実用新案登録請求の範囲】 絶縁基板の表面に、紫外線吸収剤を査有した接着剤層を
設けたアディティブ印刷配線板用基板。 ワ[Claims for Utility Model Registration] A substrate for an additive printed wiring board, in which an adhesive layer containing an ultraviolet absorber is provided on the surface of an insulating substrate. Wa
JP4731083U 1983-03-31 1983-03-31 Substrate for additive printed wiring board Pending JPS59152769U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4731083U JPS59152769U (en) 1983-03-31 1983-03-31 Substrate for additive printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4731083U JPS59152769U (en) 1983-03-31 1983-03-31 Substrate for additive printed wiring board

Publications (1)

Publication Number Publication Date
JPS59152769U true JPS59152769U (en) 1984-10-13

Family

ID=30177859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4731083U Pending JPS59152769U (en) 1983-03-31 1983-03-31 Substrate for additive printed wiring board

Country Status (1)

Country Link
JP (1) JPS59152769U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive

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