JPS6459987A - Base material for additive - Google Patents

Base material for additive

Info

Publication number
JPS6459987A
JPS6459987A JP21723187A JP21723187A JPS6459987A JP S6459987 A JPS6459987 A JP S6459987A JP 21723187 A JP21723187 A JP 21723187A JP 21723187 A JP21723187 A JP 21723187A JP S6459987 A JPS6459987 A JP S6459987A
Authority
JP
Japan
Prior art keywords
heat
resistant resin
fine particles
dispersed
ultraviolet absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21723187A
Other languages
Japanese (ja)
Other versions
JPH0634447B2 (en
Inventor
Motoo Asai
Shigeki Matsuhisa
Toshihiko Yasue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62217231A priority Critical patent/JPH0634447B2/en
Publication of JPS6459987A publication Critical patent/JPS6459987A/en
Publication of JPH0634447B2 publication Critical patent/JPH0634447B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain a substrate with which a highly reliable and highly accurate fine pattern can be formed by a method wherein heat-resistant resin fine particles, etc., which are soluble in oxidizing agent and are cured beforehand are dispersed in heat-resistant resin and some of the resin fine particles contain ultraviolet absorbing agent. CONSTITUTION:Adhesive layers are formed on both sides of a board 4. The adhesive layer is made of heat-resistant resin 1 in which heat-resistant resin fine particles which are soluble in oxidizing agent and are cured beforehand are dispersed. Further, some of the heatresistant resin fine particles contain ultraviolet absorbing agent. The adhesive layer is used as an additive substrate. The heat-resistant resin particles (fillers A) are made of epoxy resin or the like. As the ultraviolet absorbing agent, p- aminobenzoic acid or the like is used. The manufacture of a wiring board is such that the adhesive made of the heat-resistant resin 1 in which the fillers A are dispersed is applied to the board 4 of plastics, ceramics or the like and dried and cured to form the adhesive layers which are selectively etched by wet-etching with oxidizing agent such as mixed solution of chromic acid and sulfuric acid to form recessed and protruding anchors 5 and 6. After that, photoresist 7 and non-electro-plating 8 are applied to the surfaces of the adhesive layers to obtain the required wiring board.
JP62217231A 1987-08-31 1987-08-31 Adhesive for additive, base material for additive and printed wiring board using the same Expired - Lifetime JPH0634447B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62217231A JPH0634447B2 (en) 1987-08-31 1987-08-31 Adhesive for additive, base material for additive and printed wiring board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62217231A JPH0634447B2 (en) 1987-08-31 1987-08-31 Adhesive for additive, base material for additive and printed wiring board using the same

Publications (2)

Publication Number Publication Date
JPS6459987A true JPS6459987A (en) 1989-03-07
JPH0634447B2 JPH0634447B2 (en) 1994-05-02

Family

ID=16700902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62217231A Expired - Lifetime JPH0634447B2 (en) 1987-08-31 1987-08-31 Adhesive for additive, base material for additive and printed wiring board using the same

Country Status (1)

Country Link
JP (1) JPH0634447B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065405A1 (en) * 2020-09-27 2022-03-31 立山科学株式会社 Electric circuit substrate and method for manufacturing electric circuit substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS59152769U (en) * 1983-03-31 1984-10-13 日立化成工業株式会社 Substrate for additive printed wiring board
JPS6151990A (en) * 1984-08-22 1986-03-14 株式会社日立製作所 Surface metallized insulating substrate and method of producing same
JPS61276875A (en) * 1985-06-03 1986-12-06 Ibiden Co Ltd Adhesive for electroless plating and production of wiring board using said adhesive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS59152769U (en) * 1983-03-31 1984-10-13 日立化成工業株式会社 Substrate for additive printed wiring board
JPS6151990A (en) * 1984-08-22 1986-03-14 株式会社日立製作所 Surface metallized insulating substrate and method of producing same
JPS61276875A (en) * 1985-06-03 1986-12-06 Ibiden Co Ltd Adhesive for electroless plating and production of wiring board using said adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065405A1 (en) * 2020-09-27 2022-03-31 立山科学株式会社 Electric circuit substrate and method for manufacturing electric circuit substrate

Also Published As

Publication number Publication date
JPH0634447B2 (en) 1994-05-02

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