JPS53140344A - Resin composition for printed-wiring board - Google Patents

Resin composition for printed-wiring board

Info

Publication number
JPS53140344A
JPS53140344A JP5579077A JP5579077A JPS53140344A JP S53140344 A JPS53140344 A JP S53140344A JP 5579077 A JP5579077 A JP 5579077A JP 5579077 A JP5579077 A JP 5579077A JP S53140344 A JPS53140344 A JP S53140344A
Authority
JP
Japan
Prior art keywords
printed
resin composition
wiring board
etching
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5579077A
Other languages
Japanese (ja)
Other versions
JPS5844709B2 (en
Inventor
Yorio Iwasaki
Toshiro Okamura
Akishi Nakaso
Nobuo Uozu
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP52055790A priority Critical patent/JPS5844709B2/en
Priority to GB19270/78A priority patent/GB1588475A/en
Priority to US05/905,398 priority patent/US4216246A/en
Priority to DE2821303A priority patent/DE2821303B2/en
Publication of JPS53140344A publication Critical patent/JPS53140344A/en
Publication of JPS5844709B2 publication Critical patent/JPS5844709B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To prepare the title composition by dispersion of the spherical particles of an etching-proof theremosetting resin in the continuous phase of another resin liable to etching.
COPYRIGHT: (C)1978,JPO&Japio
JP52055790A 1977-05-14 1977-05-14 Resin composition for printed wiring boards Expired JPS5844709B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP52055790A JPS5844709B2 (en) 1977-05-14 1977-05-14 Resin composition for printed wiring boards
GB19270/78A GB1588475A (en) 1977-05-14 1978-05-12 Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
US05/905,398 US4216246A (en) 1977-05-14 1978-05-12 Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
DE2821303A DE2821303B2 (en) 1977-05-14 1978-05-16 A method of improving the adhesiveness of the surface of an insulating substrate and use of the substrate to manufacture a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52055790A JPS5844709B2 (en) 1977-05-14 1977-05-14 Resin composition for printed wiring boards

Publications (2)

Publication Number Publication Date
JPS53140344A true JPS53140344A (en) 1978-12-07
JPS5844709B2 JPS5844709B2 (en) 1983-10-05

Family

ID=13008697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52055790A Expired JPS5844709B2 (en) 1977-05-14 1977-05-14 Resin composition for printed wiring boards

Country Status (1)

Country Link
JP (1) JPS5844709B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
US5589255A (en) * 1988-04-28 1996-12-31 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
WO1997024229A1 (en) * 1995-12-26 1997-07-10 Ibiden Co., Ltd. Metal film bonded body, bonding agent layer and bonding agent
CN102115653A (en) * 2009-12-31 2011-07-06 比亚迪股份有限公司 Binding agent composition, preparation method and application thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346478Y2 (en) * 1984-12-19 1991-10-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278934A (en) * 1975-12-26 1977-07-02 Toshiba Corp Adhesive composition for chemical plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278934A (en) * 1975-12-26 1977-07-02 Toshiba Corp Adhesive composition for chemical plating

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6447095A (en) * 1987-08-18 1989-02-21 Ibiden Co Ltd Printed wiring board and manufacture thereof
JPS6459987A (en) * 1987-08-31 1989-03-07 Ibiden Co Ltd Base material for additive
JPH0634447B2 (en) * 1987-08-31 1994-05-02 イビデン株式会社 Adhesive for additive, base material for additive and printed wiring board using the same
US5589255A (en) * 1988-04-28 1996-12-31 Ibiden Co., Ltd. Adhesive for electroless plating, printed circuit boards and method of producing the same
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
US5447996A (en) * 1991-07-23 1995-09-05 Ibiden Co., Ltd. Adhesive comprising cured amino resin powder for printed circuit board
US5688583A (en) * 1991-07-23 1997-11-18 Ibiden Co., Ltd. Adhesive for printed circuit board
US5741575A (en) * 1991-07-23 1998-04-21 Ibiden Co., Ltd. Adhesive for printed circuit board
US5795618A (en) * 1991-07-23 1998-08-18 Ibiden Co., Ltd Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board
WO1997024229A1 (en) * 1995-12-26 1997-07-10 Ibiden Co., Ltd. Metal film bonded body, bonding agent layer and bonding agent
US6607825B1 (en) 1995-12-26 2003-08-19 Ibiden Co., Ltd. Metal film bonded body, bonding agent layer and bonding agent
CN102115653A (en) * 2009-12-31 2011-07-06 比亚迪股份有限公司 Binding agent composition, preparation method and application thereof

Also Published As

Publication number Publication date
JPS5844709B2 (en) 1983-10-05

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