JPS6447095A - Printed wiring board and manufacture thereof - Google Patents

Printed wiring board and manufacture thereof

Info

Publication number
JPS6447095A
JPS6447095A JP20480187A JP20480187A JPS6447095A JP S6447095 A JPS6447095 A JP S6447095A JP 20480187 A JP20480187 A JP 20480187A JP 20480187 A JP20480187 A JP 20480187A JP S6447095 A JPS6447095 A JP S6447095A
Authority
JP
Japan
Prior art keywords
filler
resistant resin
heat resistant
adhesion layer
oxidizing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20480187A
Other languages
Japanese (ja)
Inventor
Motoo Asai
Toshihiko Yasue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP20480187A priority Critical patent/JPS6447095A/en
Publication of JPS6447095A publication Critical patent/JPS6447095A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To improve heat resistance, moisture resistance and electrical characteristics, by adhering an adhesion layer and an electroless plating by a recessed portion from which a filler is dissolved away and left projecting part, in which the adhesion layer contains specific two kinds of fillers having different solubilities into an oxidizing agent in a heat resistant resin. CONSTITUTION:An adhesion layer 2 of approximately 2-4mum in thickness is formed by applying to an insulating layer 1 a mixed solution diffused with a filler A of fine powder of heat resistant resin previously cured having solubility to an oxidizing agent and a filler B of fine powder of heat resistant resin having low solubility to the oxidizing agent in an uncured heat resistant resin and then by drying and curing it. The grain size of the fillers A and B are preferably below 5mum in diameter on the average and the total combined quantity of the filler is preferably between 5-350pts.wt. to 100pts.wt. of the heat resistant resin. A recessed portion 7 is formed by dissolving away the filler A, 5 existing at the surface of the adhesion layer 2 using the oxidizing agent and at the same time, a projecting part 8 is formed by leaving the filler B, 6 to roughen the surface of the adhesion layer.
JP20480187A 1987-08-18 1987-08-18 Printed wiring board and manufacture thereof Pending JPS6447095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20480187A JPS6447095A (en) 1987-08-18 1987-08-18 Printed wiring board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20480187A JPS6447095A (en) 1987-08-18 1987-08-18 Printed wiring board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6447095A true JPS6447095A (en) 1989-02-21

Family

ID=16496589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20480187A Pending JPS6447095A (en) 1987-08-18 1987-08-18 Printed wiring board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6447095A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854325A (en) * 1996-05-27 1998-12-29 Sumitomo Bakelite Company Limited Photosensitive adhesive composition for additive plating
JP2002353582A (en) * 2001-05-22 2002-12-06 Hitachi Chem Co Ltd Resin-attached metal foil, multilayer printed wiring board, and manufacturing method therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS6151990A (en) * 1984-08-22 1986-03-14 株式会社日立製作所 Surface metallized insulating substrate and method of producing same
JPS61276875A (en) * 1985-06-03 1986-12-06 Ibiden Co Ltd Adhesive for electroless plating and production of wiring board using said adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS6151990A (en) * 1984-08-22 1986-03-14 株式会社日立製作所 Surface metallized insulating substrate and method of producing same
JPS61276875A (en) * 1985-06-03 1986-12-06 Ibiden Co Ltd Adhesive for electroless plating and production of wiring board using said adhesive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854325A (en) * 1996-05-27 1998-12-29 Sumitomo Bakelite Company Limited Photosensitive adhesive composition for additive plating
JP2002353582A (en) * 2001-05-22 2002-12-06 Hitachi Chem Co Ltd Resin-attached metal foil, multilayer printed wiring board, and manufacturing method therefor

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