JPS605465B2 - Film or sheet for chemical plating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to the improvement of films or sheets for chemical plating, and in particular, to improvements in films or sheets for chemical plating, which have excellent adhesion between adhesives and films, plating properties of adhesive layers, and good solder heat resistance. Regarding flexible chemical plating films or sheets.

Technical Background and Problems of the Invention In general, by roughening the surface of an insulating film or sheet by honing or other treatment, the adhesion of chemical plating can be improved and adhesion with the plating layer can be secured to some extent, but printing Heat resistance sufficient to withstand applications such as wiring boards cannot be obtained.

In order to improve this problem, forming an adhesive layer on the surface of the film can be considered, but an adhesive that has good adhesion to the film has poor adhesion to chemical plating.

Furthermore, adhesives with good plating properties have the disadvantage that sufficient adhesion to the film cannot be obtained. Purpose of the Invention The present invention has been made in view of the above-mentioned problems, and its purpose is to provide sufficient reliability with excellent adhesion strength and soldering heat resistance when an insulating film or sheet is used as a printed circuit board rather than chemically plated. An object of the present invention is to provide a chemical plating film or sheet having the following properties.

Summary of the Invention The present invention provides an insulating film or sheet with at least one side containing butadiene rubber, epoxy resin, phenol resin,
This film or sheet for chemical plating has a thermosetting adhesive layer in which finely powdered silicon oxide is blended with a resin composition made of one or more thermosetting resins such as xylene resin and melamine resin.

The insulating film or sheet of the present invention is a so-called flexible film or sheet, such as polyester film, polypropylene film, polycarbonate film, polystyrene film, polyparabanic acid film, polyimide film, etc.

Generally, the surface of the insulating film on which the adhesive layer is to be formed is preferably subjected to surface treatment in order to improve adhesive strength.
For surface treatment, mechanical surface treatment methods such as sandblasting are applied, but for polyester films and polycarbonate films, chemical treatment methods using caustic soda are used, and for polystyrene films, solvent treatment methods such as trichlene are used. A special method is corona treatment. The butadiene rubber of the adhesive used in the present invention is a polybutadiene or butadiene copolymer that exhibits a rubbery state, and includes butadiene rubber, butadiene nitrile rubber, styrene-butadiene rubber, etc., and preferably butadiene nitrile rubber. It is. An example of this is Nipole 1042 (product name manufactured by Zeon Corporation), /
- Hiker 1072, Hiker 1411 (product name manufactured by Goodrich Co., Ltd.), JSR-N-22 female (product name manufactured by Japan Synthetic Rubber Co., Ltd.), etc. The thermosetting resin composition used in the present invention comprises the above-mentioned butadiene rubber and one or more thermosetting resins such as epoxy resin, phenol resin, xylene resin, and melamine resin. The butadiene rubber is contained in this composition in an amount of usually 20 to 80% by weight, preferably 35 to 65% by weight. It has been found that the solder heat resistance can be significantly improved by further adding finely powdered silicon oxide to the above resin composition.

The amount of finely powdered silicon oxide added is preferably 5 to 2 parts by weight based on the weight of the resin composition 10. This is because if the amount added is less than 5 parts by weight, the effect cannot be obtained, and if it exceeds 2 parts by weight, the adhesion strength decreases and various properties are adversely affected, which is not good. An adhesive consisting only of the above resin composition without the addition of finely powdered silicon oxide can achieve the desired purpose if the composition is within a fairly limited range as in the reference example below. In the case of an adhesive in which finely powdered silicon oxide is added to the adhesive, the composition range of the resin composition that can be selected to achieve the purpose is widened, and the range of correspondence to the types of insulating films is widened.

The adhesive layer is formed on the insulating film or sheet by dissolving and dispersing the resin composition and finely powdered silicon oxide in methyl ethyl ketone or a mixed solvent of methyl ethyl ketone and another organic solvent such as toluene, and then roll coating or bonding. It can be easily and continuously applied by methods such as , spray method, curtain coating method, etc.

It is preferable that the adhesive layer is uniformly applied and formed on the insulating film, and the coating thickness after forming the adhesive layer is 15 to 100 mm.
Apply it so that it looks like a Buddha. If the thickness after curing is less than one thickness, the desired performance cannot be sufficiently exhibited. -Also, if it exceeds 10w, it becomes expensive in terms of cost. - The adhesive layer thus applied is dried, the organic solvent is removed by evaporation, and the adhesive layer is cured to form an adhesive layer.
Drying and curing conditions vary depending on the type of thermosetting resin contained in the adhesive layer, but generally the adhesive is cured by heating at 110 to 190° C. for 1 minute. As explained above, according to the present invention, it was possible to obtain a film or sheet for chemical plating that has good plating properties, excellent adhesion, and good solder heat resistance.

Examples of the present invention will be described below.

Example 1 5 parts of butadiene-acrylonitrile rubber, 25 parts of epoxy resin, 18 parts of phenol resin, 7 parts of het acid anhydride, 4 MZO. 1 part of silicon oxide, 10 parts of silicon oxide, and 40 parts of methyl ethyl ketone were sufficiently mixed to prepare an adhesive solution.

Next, it was coated on one side of a polyester film having a matte finish and having a thickness of 5 mm, and was dried and cured at 15,000° C. for 2 minutes to obtain a polyester film with an adhesive layer having a thickness of 25 mm. This film was immersed in a chromic acid-sulfuric acid mixture of 5000 and a specific gravity of 1.4 for 3 minutes to roughen the surface of the adhesive layer to obtain a polyester film for chemical plating. Next, chemical plating is applied using a conventional method to a thickness of approximately 0. A copper laminate layer was applied over the next three months, and then electroplating was applied and overlaying was carried out after about 3 months to obtain a polyester film for printed circuits. Plating properties were good. When the film provided with the above-mentioned copper laminate layer was tested in accordance with the JISC-6481 test method for copper-clad laminates for printed circuits, the peel strength was 1.9k9/c, and the solder heat resistance was confirmed. 'Ma49 Sand/230
It was midnight. Example 2 The polyester film surface was
A film with a copper glazing layer was obtained in exactly the same manner as in Example 1, except that an untreated film was used, and a test was conducted on the same machine. The peel strength was 1.5k9 / 伽, and the solder Heat resistance was 35 sand/23 pi0.

Example 3 A polyimide film with an adhesive layer was obtained in the same manner as in Example 1 except that a polyimide film was used, and when the film was treated in the same manner and tested in the same manner, the peel strength was 1.
．． The solder heat resistance was 18 seconds/260q0.

Example 4 An adhesive solution was prepared by thoroughly mixing 65 parts of butadiene-acrylonitrile rubber, 25 parts of urethane-modified epoxy resin, 10 parts of phenol resin, 6 parts of silicon oxide, and 50 parts of methyl ethyl ketone.

Next, it was applied to one side of a polyimide film with a matte finish and dried and cured at 120 qo for 30 minutes to give an adhesive thickness of 3.
A polyimide film with a cape skin adhesive layer was obtained. Next, a copper-plated polyimide film was obtained in the same manner as in Example 1, and a similar test was conducted, and it was found that the peel strength was 1.
．． 6kg / 26000, solder heat resistance is 16 steps / 26000
Met. Example 5 A polyimide film with a copper glazing layer was obtained in exactly the same manner as in Example 3 except that silicon oxide was used as the second base.

When a similar test was conducted, the peel strength was 1.4.
The solder heat resistance of X9/c was 20 sand/260oC. Example 6 An adhesive solution was prepared in the same manner as in Example 1 except that butyl cellosolve was used instead of methyl ethyl ketone, and it was applied to one side of a polyparabanic acid film, and dried and cured in 150 CO in two powders to adjust the adhesive thickness. A polyparabanic acid film with an adhesive layer having a diameter of 25 mm was obtained.

This was then treated and tested in the same manner as in Example 1, and the peel strength was 1.7 k9/skin and the solder heat resistance was 7 sand/260 qo. Example 7 65 parts of butadiene-acrylonitrile rubber, 28 parts of epoxy resin, 7.8 parts of diaminodiphenylsulfone as a curing agent,
8 parts of silicon oxide was mixed with methyl ethyl ketone-dioxane (
40 parts of a mixed solvent (3:1 weight ratio) were sufficiently mixed and dispersed to prepare an adhesive solution.

Apply this saddle adhesive to polyparabanic acid film and apply 110
After drying at 0 for 10 minutes to remove the solvent, it was further cured at 170 qo for 15 minutes to obtain a polyparabanic acid film with an adhesive layer having an adhesive thickness of 3 m. Next, a copper-plated polyvalabanic acid film was obtained in the same manner as in Example 1, and the same test was conducted, and the peel strength was 2.0k9/伽, and the solder heat resistance was 65 sand/260o○. . Example 8 The adhesive consisted of 5 parts of butadiene-acrylonitrile rubber, 32 parts of phenolic resin, and 8 parts of silicon oxide,
A polyparabanic acid film with a copper plating layer was obtained in the same manner as in Example 7 except that methyl ethyl ketone was used as the solvent.

When tested on the same machine, the peeling strength was 1.6k9/
Skin and solder heat resistance were 75 seconds/260 times. Reference example 5 parts of butadiene-acrylonitrile rubber, 1 part of phenol resin, 1 part of xylene resin, 15 parts of epoxy resin, 4.5 parts of methylnadic acid anhydride as a hardening agent for the epoxy resin, and 2-ethyl-4-4 as an accelerator. An adhesive consisting of 0.1 part of methylimidazole and a mixed solvent of methyl ethyl ketone: toluene: butyl cellosol (2:1:1 weight ratio) was prepared, and a copper-plated polyparabanic acid film was prepared in the same manner as in Example 7. When the same test was conducted on the obtained product, the peel strength was 1.8 kg/2, and the solder heat resistance was 7/26,000.

Claims (1)

[Scope of Claims] 1. A film or sheet for chemical plating, which has a thermosetting adhesive layer made of a thermosetting resin composition containing butadiene rubber and finely powdered silicon oxide on at least one side of the insulating film or sheet. 2. The film or sheet according to claim 1, wherein the thermosetting resin composition comprises a butadiene rubber and one or more of epoxy resin, phenol resin, xylene resin, and melamine resin.