JPS5278934A - Adhesive composition for chemical plating - Google Patents
Adhesive composition for chemical platingInfo
- Publication number
- JPS5278934A JPS5278934A JP15476875A JP15476875A JPS5278934A JP S5278934 A JPS5278934 A JP S5278934A JP 15476875 A JP15476875 A JP 15476875A JP 15476875 A JP15476875 A JP 15476875A JP S5278934 A JPS5278934 A JP S5278934A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- chemical plating
- soldering
- phenolic
- epoxy resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: An adhesive composition suitable for primary coating in chemical plating forming firmly adhered plating layer and having good resistance to soldering, which is characterized by adding a phenolic and an epoxy resins to an acrylonitrile rubber.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15476875A JPS5278934A (en) | 1975-12-26 | 1975-12-26 | Adhesive composition for chemical plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15476875A JPS5278934A (en) | 1975-12-26 | 1975-12-26 | Adhesive composition for chemical plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5278934A true JPS5278934A (en) | 1977-07-02 |
JPS5716495B2 JPS5716495B2 (en) | 1982-04-05 |
Family
ID=15591459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15476875A Granted JPS5278934A (en) | 1975-12-26 | 1975-12-26 | Adhesive composition for chemical plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5278934A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134834A (en) * | 1977-04-30 | 1978-11-24 | Mitsubishi Electric Corp | Resin composition for bonding |
JPS53140344A (en) * | 1977-05-14 | 1978-12-07 | Hitachi Chem Co Ltd | Resin composition for printed-wiring board |
JPS58157877A (en) * | 1982-03-15 | 1983-09-20 | Hitachi Ltd | Adhesive for electroless plating and method of using the same |
JPH01254787A (en) * | 1988-04-04 | 1989-10-11 | Mitsubishi Petrochem Co Ltd | Adhesive composition for cladding foil |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198194U (en) * | 1984-12-03 | 1986-06-24 | ||
CN104073198A (en) * | 2014-06-26 | 2014-10-01 | 安徽神舟飞船胶业有限公司 | Formula and preparation process of non-toxic epoxy resin adhesive |
-
1975
- 1975-12-26 JP JP15476875A patent/JPS5278934A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134834A (en) * | 1977-04-30 | 1978-11-24 | Mitsubishi Electric Corp | Resin composition for bonding |
JPS53140344A (en) * | 1977-05-14 | 1978-12-07 | Hitachi Chem Co Ltd | Resin composition for printed-wiring board |
JPS5844709B2 (en) * | 1977-05-14 | 1983-10-05 | 日立化成工業株式会社 | Resin composition for printed wiring boards |
JPS58157877A (en) * | 1982-03-15 | 1983-09-20 | Hitachi Ltd | Adhesive for electroless plating and method of using the same |
JPS6310752B2 (en) * | 1982-03-15 | 1988-03-09 | Hitachi Ltd | |
JPH01254787A (en) * | 1988-04-04 | 1989-10-11 | Mitsubishi Petrochem Co Ltd | Adhesive composition for cladding foil |
Also Published As
Publication number | Publication date |
---|---|
JPS5716495B2 (en) | 1982-04-05 |
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