JPS5278934A - Adhesive composition for chemical plating - Google Patents

Adhesive composition for chemical plating

Info

Publication number
JPS5278934A
JPS5278934A JP15476875A JP15476875A JPS5278934A JP S5278934 A JPS5278934 A JP S5278934A JP 15476875 A JP15476875 A JP 15476875A JP 15476875 A JP15476875 A JP 15476875A JP S5278934 A JPS5278934 A JP S5278934A
Authority
JP
Japan
Prior art keywords
adhesive composition
chemical plating
soldering
phenolic
epoxy resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15476875A
Other languages
Japanese (ja)
Other versions
JPS5716495B2 (en
Inventor
Kunihiro Isori
Hirohisa Kato
Hitoshi Tomii
Akira Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15476875A priority Critical patent/JPS5278934A/en
Publication of JPS5278934A publication Critical patent/JPS5278934A/en
Publication of JPS5716495B2 publication Critical patent/JPS5716495B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: An adhesive composition suitable for primary coating in chemical plating forming firmly adhered plating layer and having good resistance to soldering, which is characterized by adding a phenolic and an epoxy resins to an acrylonitrile rubber.
COPYRIGHT: (C)1977,JPO&Japio
JP15476875A 1975-12-26 1975-12-26 Adhesive composition for chemical plating Granted JPS5278934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15476875A JPS5278934A (en) 1975-12-26 1975-12-26 Adhesive composition for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15476875A JPS5278934A (en) 1975-12-26 1975-12-26 Adhesive composition for chemical plating

Publications (2)

Publication Number Publication Date
JPS5278934A true JPS5278934A (en) 1977-07-02
JPS5716495B2 JPS5716495B2 (en) 1982-04-05

Family

ID=15591459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15476875A Granted JPS5278934A (en) 1975-12-26 1975-12-26 Adhesive composition for chemical plating

Country Status (1)

Country Link
JP (1) JPS5278934A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS58157877A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Adhesive for electroless plating and method of using the same
JPH01254787A (en) * 1988-04-04 1989-10-11 Mitsubishi Petrochem Co Ltd Adhesive composition for cladding foil

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198194U (en) * 1984-12-03 1986-06-24
CN104073198A (en) * 2014-06-26 2014-10-01 安徽神舟飞船胶业有限公司 Formula and preparation process of non-toxic epoxy resin adhesive

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding
JPS53140344A (en) * 1977-05-14 1978-12-07 Hitachi Chem Co Ltd Resin composition for printed-wiring board
JPS5844709B2 (en) * 1977-05-14 1983-10-05 日立化成工業株式会社 Resin composition for printed wiring boards
JPS58157877A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Adhesive for electroless plating and method of using the same
JPS6310752B2 (en) * 1982-03-15 1988-03-09 Hitachi Ltd
JPH01254787A (en) * 1988-04-04 1989-10-11 Mitsubishi Petrochem Co Ltd Adhesive composition for cladding foil

Also Published As

Publication number Publication date
JPS5716495B2 (en) 1982-04-05

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