JPS53134834A - Resin composition for bonding - Google Patents

Resin composition for bonding

Info

Publication number
JPS53134834A
JPS53134834A JP5042177A JP5042177A JPS53134834A JP S53134834 A JPS53134834 A JP S53134834A JP 5042177 A JP5042177 A JP 5042177A JP 5042177 A JP5042177 A JP 5042177A JP S53134834 A JPS53134834 A JP S53134834A
Authority
JP
Japan
Prior art keywords
bonding
resin composition
woven
epoxy
impregnation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5042177A
Other languages
Japanese (ja)
Inventor
Masaru Dobashi
Ichiro Yamazaki
Yoshihiro Koyama
Goro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5042177A priority Critical patent/JPS53134834A/en
Publication of JPS53134834A publication Critical patent/JPS53134834A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To impart the initial bond strength to an epoxy resin and reduce the impregnation of woven or non-woven fabrics, by incorporating a mixture of a phenolic resin and acrylonitrile-butadiene copolymer into an epoxy varnish.
COPYRIGHT: (C)1978,JPO&Japio
JP5042177A 1977-04-30 1977-04-30 Resin composition for bonding Pending JPS53134834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5042177A JPS53134834A (en) 1977-04-30 1977-04-30 Resin composition for bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5042177A JPS53134834A (en) 1977-04-30 1977-04-30 Resin composition for bonding

Publications (1)

Publication Number Publication Date
JPS53134834A true JPS53134834A (en) 1978-11-24

Family

ID=12858390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5042177A Pending JPS53134834A (en) 1977-04-30 1977-04-30 Resin composition for bonding

Country Status (1)

Country Link
JP (1) JPS53134834A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5721427A (en) * 1980-07-11 1982-02-04 Toho Rayon Co Ltd Prepreg
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910228A (en) * 1972-05-26 1974-01-29
JPS5278934A (en) * 1975-12-26 1977-07-02 Toshiba Corp Adhesive composition for chemical plating
JPS5349055A (en) * 1976-10-15 1978-05-04 Matsushita Electric Works Ltd Thermosetting composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910228A (en) * 1972-05-26 1974-01-29
JPS5278934A (en) * 1975-12-26 1977-07-02 Toshiba Corp Adhesive composition for chemical plating
JPS5349055A (en) * 1976-10-15 1978-05-04 Matsushita Electric Works Ltd Thermosetting composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5721427A (en) * 1980-07-11 1982-02-04 Toho Rayon Co Ltd Prepreg
JPS6039286B2 (en) * 1980-07-11 1985-09-05 東邦レーヨン株式会社 prepreg
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition

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