JPS5349055A - Thermosetting composition - Google Patents

Thermosetting composition

Info

Publication number
JPS5349055A
JPS5349055A JP12420776A JP12420776A JPS5349055A JP S5349055 A JPS5349055 A JP S5349055A JP 12420776 A JP12420776 A JP 12420776A JP 12420776 A JP12420776 A JP 12420776A JP S5349055 A JPS5349055 A JP S5349055A
Authority
JP
Japan
Prior art keywords
thermosetting composition
giving
resin
cured product
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12420776A
Other languages
Japanese (ja)
Inventor
Toshio Nakanishi
Hideo Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12420776A priority Critical patent/JPS5349055A/en
Publication of JPS5349055A publication Critical patent/JPS5349055A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide a thermosetting composition having long storage life and giving a cured product having improved heat resistance, impact resistance and adhesive power to metal, comprising an epoxy compound, a resin giving flexibility and a novolak resin.
COPYRIGHT: (C)1978,JPO&Japio
JP12420776A 1976-10-15 1976-10-15 Thermosetting composition Pending JPS5349055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12420776A JPS5349055A (en) 1976-10-15 1976-10-15 Thermosetting composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12420776A JPS5349055A (en) 1976-10-15 1976-10-15 Thermosetting composition

Publications (1)

Publication Number Publication Date
JPS5349055A true JPS5349055A (en) 1978-05-04

Family

ID=14879632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12420776A Pending JPS5349055A (en) 1976-10-15 1976-10-15 Thermosetting composition

Country Status (1)

Country Link
JP (1) JPS5349055A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding
JPS555936A (en) * 1978-06-27 1980-01-17 Hitachi Chem Co Ltd Coating resin composition
JPS55125155A (en) * 1979-03-20 1980-09-26 Yokohama Rubber Co Ltd:The Polymer composition having good adhesion property to brass
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition
JPS59189179A (en) * 1983-04-13 1984-10-26 Mitsubishi Rayon Co Ltd One-pack type epoxy resin adhesive composition
JPS6181424A (en) * 1984-09-28 1986-04-25 Mitsui Toatsu Chem Inc Thermosetting composition
JPS62141082A (en) * 1985-12-13 1987-06-24 Nok Corp Vulcanizing adhesive composition and bonding by using it
JPS638469A (en) * 1986-06-27 1988-01-14 Uchiyama Mfg Corp Water-resistant adhesive
WO1999032936A1 (en) * 1997-12-23 1999-07-01 Bp Amoco Corporation Photoimageable compositions and films for printed wiring board manufacture
US5990204A (en) * 1997-10-31 1999-11-23 Onizawa; Masao Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding
JPS555936A (en) * 1978-06-27 1980-01-17 Hitachi Chem Co Ltd Coating resin composition
JPS5632343B2 (en) * 1978-06-27 1981-07-27
JPS55125155A (en) * 1979-03-20 1980-09-26 Yokohama Rubber Co Ltd:The Polymer composition having good adhesion property to brass
JPS6126820B2 (en) * 1979-03-20 1986-06-23 Yokohama Rubber Co Ltd
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition
JPH0334513B2 (en) * 1983-04-13 1991-05-22 Mitsubishi Rayon Co
JPS59189179A (en) * 1983-04-13 1984-10-26 Mitsubishi Rayon Co Ltd One-pack type epoxy resin adhesive composition
JPS6181424A (en) * 1984-09-28 1986-04-25 Mitsui Toatsu Chem Inc Thermosetting composition
JPH0336047B2 (en) * 1984-09-28 1991-05-30 Mitsui Toatsu Chemicals
JPS62141082A (en) * 1985-12-13 1987-06-24 Nok Corp Vulcanizing adhesive composition and bonding by using it
JPH0586987B2 (en) * 1985-12-13 1993-12-15 Nok Corp
JPS638469A (en) * 1986-06-27 1988-01-14 Uchiyama Mfg Corp Water-resistant adhesive
US5990204A (en) * 1997-10-31 1999-11-23 Onizawa; Masao Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins
WO1999032936A1 (en) * 1997-12-23 1999-07-01 Bp Amoco Corporation Photoimageable compositions and films for printed wiring board manufacture

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