JPS5349055A - Thermosetting composition - Google Patents
Thermosetting compositionInfo
- Publication number
- JPS5349055A JPS5349055A JP12420776A JP12420776A JPS5349055A JP S5349055 A JPS5349055 A JP S5349055A JP 12420776 A JP12420776 A JP 12420776A JP 12420776 A JP12420776 A JP 12420776A JP S5349055 A JPS5349055 A JP S5349055A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting composition
- giving
- resin
- cured product
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To provide a thermosetting composition having long storage life and giving a cured product having improved heat resistance, impact resistance and adhesive power to metal, comprising an epoxy compound, a resin giving flexibility and a novolak resin.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12420776A JPS5349055A (en) | 1976-10-15 | 1976-10-15 | Thermosetting composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12420776A JPS5349055A (en) | 1976-10-15 | 1976-10-15 | Thermosetting composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5349055A true JPS5349055A (en) | 1978-05-04 |
Family
ID=14879632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12420776A Pending JPS5349055A (en) | 1976-10-15 | 1976-10-15 | Thermosetting composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5349055A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134834A (en) * | 1977-04-30 | 1978-11-24 | Mitsubishi Electric Corp | Resin composition for bonding |
JPS555936A (en) * | 1978-06-27 | 1980-01-17 | Hitachi Chem Co Ltd | Coating resin composition |
JPS55125155A (en) * | 1979-03-20 | 1980-09-26 | Yokohama Rubber Co Ltd:The | Polymer composition having good adhesion property to brass |
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPS59189179A (en) * | 1983-04-13 | 1984-10-26 | Mitsubishi Rayon Co Ltd | One-pack type epoxy resin adhesive composition |
JPS6181424A (en) * | 1984-09-28 | 1986-04-25 | Mitsui Toatsu Chem Inc | Thermosetting composition |
JPS62141082A (en) * | 1985-12-13 | 1987-06-24 | Nok Corp | Vulcanizing adhesive composition and bonding by using it |
JPS638469A (en) * | 1986-06-27 | 1988-01-14 | Uchiyama Mfg Corp | Water-resistant adhesive |
WO1999032936A1 (en) * | 1997-12-23 | 1999-07-01 | Bp Amoco Corporation | Photoimageable compositions and films for printed wiring board manufacture |
US5990204A (en) * | 1997-10-31 | 1999-11-23 | Onizawa; Masao | Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins |
-
1976
- 1976-10-15 JP JP12420776A patent/JPS5349055A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53134834A (en) * | 1977-04-30 | 1978-11-24 | Mitsubishi Electric Corp | Resin composition for bonding |
JPS555936A (en) * | 1978-06-27 | 1980-01-17 | Hitachi Chem Co Ltd | Coating resin composition |
JPS5632343B2 (en) * | 1978-06-27 | 1981-07-27 | ||
JPS55125155A (en) * | 1979-03-20 | 1980-09-26 | Yokohama Rubber Co Ltd:The | Polymer composition having good adhesion property to brass |
JPS6126820B2 (en) * | 1979-03-20 | 1986-06-23 | Yokohama Rubber Co Ltd | |
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPH0334513B2 (en) * | 1983-04-13 | 1991-05-22 | Mitsubishi Rayon Co | |
JPS59189179A (en) * | 1983-04-13 | 1984-10-26 | Mitsubishi Rayon Co Ltd | One-pack type epoxy resin adhesive composition |
JPS6181424A (en) * | 1984-09-28 | 1986-04-25 | Mitsui Toatsu Chem Inc | Thermosetting composition |
JPH0336047B2 (en) * | 1984-09-28 | 1991-05-30 | Mitsui Toatsu Chemicals | |
JPS62141082A (en) * | 1985-12-13 | 1987-06-24 | Nok Corp | Vulcanizing adhesive composition and bonding by using it |
JPH0586987B2 (en) * | 1985-12-13 | 1993-12-15 | Nok Corp | |
JPS638469A (en) * | 1986-06-27 | 1988-01-14 | Uchiyama Mfg Corp | Water-resistant adhesive |
US5990204A (en) * | 1997-10-31 | 1999-11-23 | Onizawa; Masao | Crosslinking isoprene-isobutylene rubber with alkyphenol-formaldehyde and epoxy resins |
WO1999032936A1 (en) * | 1997-12-23 | 1999-07-01 | Bp Amoco Corporation | Photoimageable compositions and films for printed wiring board manufacture |
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