JPS51129498A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS51129498A JPS51129498A JP50039191A JP3919175A JPS51129498A JP S51129498 A JPS51129498 A JP S51129498A JP 50039191 A JP50039191 A JP 50039191A JP 3919175 A JP3919175 A JP 3919175A JP S51129498 A JPS51129498 A JP S51129498A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- compn
- mech
- usable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: The compn. with excellent mech. and electrical properties and usable as materials for flexible prepreg tapes comprises 2 kinds of epoxide resins and a phenolic curing agent.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50039191A JPS51129498A (en) | 1975-04-02 | 1975-04-02 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50039191A JPS51129498A (en) | 1975-04-02 | 1975-04-02 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51129498A true JPS51129498A (en) | 1976-11-11 |
JPS5419919B2 JPS5419919B2 (en) | 1979-07-18 |
Family
ID=12546212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50039191A Granted JPS51129498A (en) | 1975-04-02 | 1975-04-02 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51129498A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57113062A (en) * | 1980-12-31 | 1982-07-14 | Toshiba Chem Prod | Copper plated laminated board |
JPS60255831A (en) * | 1984-06-01 | 1985-12-17 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminate |
JPS63135434A (en) * | 1986-11-26 | 1988-06-07 | Shin Kobe Electric Mach Co Ltd | Production of epoxy resin laminate |
EP0379468A2 (en) * | 1989-01-20 | 1990-07-25 | Ciba-Geigy Ag | Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups |
WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
WO1997047689A1 (en) * | 1996-06-14 | 1997-12-18 | Cytec Technology Corp. | Curable thermoset resin composition |
US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
CN1073127C (en) * | 1995-09-29 | 2001-10-17 | 东芝化学株式会社 | Hologen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS475947A (en) * | 1970-09-03 | 1972-03-31 | ||
JPS4851997A (en) * | 1971-10-28 | 1973-07-21 |
-
1975
- 1975-04-02 JP JP50039191A patent/JPS51129498A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS475947A (en) * | 1970-09-03 | 1972-03-31 | ||
JPS4851997A (en) * | 1971-10-28 | 1973-07-21 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57113062A (en) * | 1980-12-31 | 1982-07-14 | Toshiba Chem Prod | Copper plated laminated board |
JPS60255831A (en) * | 1984-06-01 | 1985-12-17 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminate |
JPH0374256B2 (en) * | 1984-06-01 | 1991-11-26 | ||
JPH0369935B2 (en) * | 1986-11-26 | 1991-11-05 | Shin Kobe Electric Machinery | |
JPS63135434A (en) * | 1986-11-26 | 1988-06-07 | Shin Kobe Electric Mach Co Ltd | Production of epoxy resin laminate |
EP0379468A2 (en) * | 1989-01-20 | 1990-07-25 | Ciba-Geigy Ag | Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups |
US5006611A (en) * | 1989-01-20 | 1991-04-09 | Ciba-Geigy Corporation | Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups |
WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
US5955184A (en) * | 1995-09-29 | 1999-09-21 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same |
US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
CN1073127C (en) * | 1995-09-29 | 2001-10-17 | 东芝化学株式会社 | Hologen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
WO1997047689A1 (en) * | 1996-06-14 | 1997-12-18 | Cytec Technology Corp. | Curable thermoset resin composition |
US6265491B1 (en) | 1996-06-14 | 2001-07-24 | Cytec Technology Corp. | Curable thermoset resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5419919B2 (en) | 1979-07-18 |
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