JPS53123457A - Molding resin composition - Google Patents

Molding resin composition

Info

Publication number
JPS53123457A
JPS53123457A JP3812977A JP3812977A JPS53123457A JP S53123457 A JPS53123457 A JP S53123457A JP 3812977 A JP3812977 A JP 3812977A JP 3812977 A JP3812977 A JP 3812977A JP S53123457 A JPS53123457 A JP S53123457A
Authority
JP
Japan
Prior art keywords
resin composition
molding resin
particle size
filler
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3812977A
Other languages
Japanese (ja)
Other versions
JPS6010533B2 (en
Inventor
Shunichi Numata
Ataru Yokono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52038129A priority Critical patent/JPS6010533B2/en
Publication of JPS53123457A publication Critical patent/JPS53123457A/en
Publication of JPS6010533B2 publication Critical patent/JPS6010533B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: A molding resin composition having a small particle size and improved workability, capable of giving uniform filler distribution after curing due to little sedimentation of filler up to the curing of a thermosetting resin, comprising an inorganic filler having a specific particle size and particle size distribution and the thermosetting resin.
COPYRIGHT: (C)1978,JPO&Japio
JP52038129A 1977-04-05 1977-04-05 Molding resin composition Expired JPS6010533B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52038129A JPS6010533B2 (en) 1977-04-05 1977-04-05 Molding resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52038129A JPS6010533B2 (en) 1977-04-05 1977-04-05 Molding resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3520986A Division JPS61222106A (en) 1986-02-21 1986-02-21 Resin molded electric winding for transformer

Publications (2)

Publication Number Publication Date
JPS53123457A true JPS53123457A (en) 1978-10-27
JPS6010533B2 JPS6010533B2 (en) 1985-03-18

Family

ID=12516832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52038129A Expired JPS6010533B2 (en) 1977-04-05 1977-04-05 Molding resin composition

Country Status (1)

Country Link
JP (1) JPS6010533B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108021A (en) * 1986-10-24 1988-05-12 Hitachi Ltd Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JPS63128020A (en) * 1986-11-18 1988-05-31 Hitachi Ltd Epoxy resin composition and resin-sealed type semiconductor device
JPH0770282A (en) * 1994-05-09 1995-03-14 Hitachi Ltd Epoxy resin composition used for semiconductor sealing

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227781Y2 (en) * 1985-09-03 1990-07-26
KR102611020B1 (en) 2017-03-29 2023-12-07 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Polyimide, polyimide solution and polyimide film
WO2019163830A1 (en) 2018-02-23 2019-08-29 三菱瓦斯化学株式会社 Polyimide resin, polyimide varnish and polyimide film
JP7095115B2 (en) * 2019-06-20 2022-07-04 Ｊｆｅケミカル株式会社 Polyimide solution and polyimide

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727894A (en) * 1980-07-07 1982-02-15 Buriizu Kooporeeshiyonzu Inc Takeup for cable

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727894A (en) * 1980-07-07 1982-02-15 Buriizu Kooporeeshiyonzu Inc Takeup for cable

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108021A (en) * 1986-10-24 1988-05-12 Hitachi Ltd Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JPS63128020A (en) * 1986-11-18 1988-05-31 Hitachi Ltd Epoxy resin composition and resin-sealed type semiconductor device
JPH0554865B2 (en) * 1986-11-18 1993-08-13 Hitachi Ltd
JPH0680863A (en) * 1986-11-18 1994-03-22 Hitachi Ltd Epoxy resin composition
JPH0770282A (en) * 1994-05-09 1995-03-14 Hitachi Ltd Epoxy resin composition used for semiconductor sealing

Also Published As

Publication number Publication date
JPS6010533B2 (en) 1985-03-18

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