JPS5258469A - Resin-molded type semiconductor device - Google Patents
Resin-molded type semiconductor deviceInfo
- Publication number
- JPS5258469A JPS5258469A JP13409675A JP13409675A JPS5258469A JP S5258469 A JPS5258469 A JP S5258469A JP 13409675 A JP13409675 A JP 13409675A JP 13409675 A JP13409675 A JP 13409675A JP S5258469 A JPS5258469 A JP S5258469A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- type semiconductor
- molded type
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To eliminate the corrosion of electrodes and wiring layers by interposing a semi-setting material between the polyimide resin layer and a molding resin in a semiconductor substrate covered with a hardened polyimide resin layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13409675A JPS5258469A (en) | 1975-11-10 | 1975-11-10 | Resin-molded type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13409675A JPS5258469A (en) | 1975-11-10 | 1975-11-10 | Resin-molded type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5258469A true JPS5258469A (en) | 1977-05-13 |
Family
ID=15120332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13409675A Pending JPS5258469A (en) | 1975-11-10 | 1975-11-10 | Resin-molded type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5258469A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763831A (en) * | 1980-10-06 | 1982-04-17 | Nec Corp | Semiconductor device |
US4630095A (en) * | 1980-03-31 | 1986-12-16 | Vlsi Technology Research Association | Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering |
US4733289A (en) * | 1980-04-25 | 1988-03-22 | Hitachi, Ltd. | Resin-molded semiconductor device using polyimide and nitride films for the passivation film |
US4974057A (en) * | 1986-10-31 | 1990-11-27 | Texas Instruments Incorporated | Semiconductor device package with circuit board and resin |
US5144407A (en) * | 1989-07-03 | 1992-09-01 | General Electric Company | Semiconductor chip protection layer and protected chip |
-
1975
- 1975-11-10 JP JP13409675A patent/JPS5258469A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4630095A (en) * | 1980-03-31 | 1986-12-16 | Vlsi Technology Research Association | Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering |
US4733289A (en) * | 1980-04-25 | 1988-03-22 | Hitachi, Ltd. | Resin-molded semiconductor device using polyimide and nitride films for the passivation film |
US4990993A (en) * | 1980-04-25 | 1991-02-05 | Hitachi, Ltd. | Resin-molded semiconductor device using polymide and nitride films for the passivation film |
JPS5763831A (en) * | 1980-10-06 | 1982-04-17 | Nec Corp | Semiconductor device |
JPS6258530B2 (en) * | 1980-10-06 | 1987-12-07 | Nippon Electric Co | |
US4974057A (en) * | 1986-10-31 | 1990-11-27 | Texas Instruments Incorporated | Semiconductor device package with circuit board and resin |
US5144407A (en) * | 1989-07-03 | 1992-09-01 | General Electric Company | Semiconductor chip protection layer and protected chip |
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