JPS5258469A - Resin-molded type semiconductor device - Google Patents

Resin-molded type semiconductor device

Info

Publication number
JPS5258469A
JPS5258469A JP13409675A JP13409675A JPS5258469A JP S5258469 A JPS5258469 A JP S5258469A JP 13409675 A JP13409675 A JP 13409675A JP 13409675 A JP13409675 A JP 13409675A JP S5258469 A JPS5258469 A JP S5258469A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
type semiconductor
molded type
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13409675A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Tokio Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13409675A priority Critical patent/JPS5258469A/en
Publication of JPS5258469A publication Critical patent/JPS5258469A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate the corrosion of electrodes and wiring layers by interposing a semi-setting material between the polyimide resin layer and a molding resin in a semiconductor substrate covered with a hardened polyimide resin layer.
COPYRIGHT: (C)1977,JPO&Japio
JP13409675A 1975-11-10 1975-11-10 Resin-molded type semiconductor device Pending JPS5258469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13409675A JPS5258469A (en) 1975-11-10 1975-11-10 Resin-molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13409675A JPS5258469A (en) 1975-11-10 1975-11-10 Resin-molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5258469A true JPS5258469A (en) 1977-05-13

Family

ID=15120332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13409675A Pending JPS5258469A (en) 1975-11-10 1975-11-10 Resin-molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5258469A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763831A (en) * 1980-10-06 1982-04-17 Nec Corp Semiconductor device
US4630095A (en) * 1980-03-31 1986-12-16 Vlsi Technology Research Association Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering
US4733289A (en) * 1980-04-25 1988-03-22 Hitachi, Ltd. Resin-molded semiconductor device using polyimide and nitride films for the passivation film
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4630095A (en) * 1980-03-31 1986-12-16 Vlsi Technology Research Association Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering
US4733289A (en) * 1980-04-25 1988-03-22 Hitachi, Ltd. Resin-molded semiconductor device using polyimide and nitride films for the passivation film
US4990993A (en) * 1980-04-25 1991-02-05 Hitachi, Ltd. Resin-molded semiconductor device using polymide and nitride films for the passivation film
JPS5763831A (en) * 1980-10-06 1982-04-17 Nec Corp Semiconductor device
JPS6258530B2 (en) * 1980-10-06 1987-12-07 Nippon Electric Co
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip

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