JPS5237768A - Substrate having positioning marks - Google Patents

Substrate having positioning marks

Info

Publication number
JPS5237768A
JPS5237768A JP50113271A JP11327175A JPS5237768A JP S5237768 A JPS5237768 A JP S5237768A JP 50113271 A JP50113271 A JP 50113271A JP 11327175 A JP11327175 A JP 11327175A JP S5237768 A JPS5237768 A JP S5237768A
Authority
JP
Japan
Prior art keywords
substrate
positioning marks
positioning
marks
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50113271A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hirasawa
Takichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP50113271A priority Critical patent/JPS5237768A/en
Publication of JPS5237768A publication Critical patent/JPS5237768A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: In positioning of wiring electrodes of resin materials and semiconductor elements, positioning marks are formed on a substrate made of a resin material, whereby complete automation is made possible.
COPYRIGHT: (C)1977,JPO&Japio
JP50113271A 1975-09-19 1975-09-19 Substrate having positioning marks Pending JPS5237768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50113271A JPS5237768A (en) 1975-09-19 1975-09-19 Substrate having positioning marks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50113271A JPS5237768A (en) 1975-09-19 1975-09-19 Substrate having positioning marks

Publications (1)

Publication Number Publication Date
JPS5237768A true JPS5237768A (en) 1977-03-23

Family

ID=14607928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50113271A Pending JPS5237768A (en) 1975-09-19 1975-09-19 Substrate having positioning marks

Country Status (1)

Country Link
JP (1) JPS5237768A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110244A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Printed circuit board for semiconductor device and wire bonding method thereof
JPS5793148U (en) * 1980-11-27 1982-06-08
US4382386A (en) * 1979-09-28 1983-05-10 Thomson-Csf Elastic surface wave pressure gauge and pressure sensor for such a gauge
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
JPS6242241U (en) * 1986-08-08 1987-03-13
JPS62234337A (en) * 1986-04-04 1987-10-14 Hitachi Cable Ltd Film carrier for semiconductor device
JPS62204328U (en) * 1986-06-16 1987-12-26
JPH02129940A (en) * 1988-11-09 1990-05-18 Ibiden Co Ltd Electronic component mounting film carrier and its manufacture
US4941256A (en) * 1988-08-19 1990-07-17 Canadian Patents & Development Ltd. Automatic visual measurement of surface mount device placement
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
JP2003017818A (en) * 2001-06-28 2003-01-17 Kyocera Corp Flexible circuit board and display unit

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382386A (en) * 1979-09-28 1983-05-10 Thomson-Csf Elastic surface wave pressure gauge and pressure sensor for such a gauge
JPS56110244A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Printed circuit board for semiconductor device and wire bonding method thereof
JPS6337498B2 (en) * 1980-02-06 1988-07-26 Hitachi Seisakusho Kk
JPS5793148U (en) * 1980-11-27 1982-06-08
JPS6035249Y2 (en) * 1980-11-27 1985-10-19 日本電気株式会社 Circuit board for semiconductor devices
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
JPS62234337A (en) * 1986-04-04 1987-10-14 Hitachi Cable Ltd Film carrier for semiconductor device
JPS62204328U (en) * 1986-06-16 1987-12-26
JPS6242241U (en) * 1986-08-08 1987-03-13
US4941256A (en) * 1988-08-19 1990-07-17 Canadian Patents & Development Ltd. Automatic visual measurement of surface mount device placement
JPH02129940A (en) * 1988-11-09 1990-05-18 Ibiden Co Ltd Electronic component mounting film carrier and its manufacture
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
JP2003017818A (en) * 2001-06-28 2003-01-17 Kyocera Corp Flexible circuit board and display unit
JP4587607B2 (en) * 2001-06-28 2010-11-24 京セラ株式会社 Flexible circuit board and display device

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