JPS56110244A - Printed circuit board for semiconductor device and wire bonding method thereof - Google Patents

Printed circuit board for semiconductor device and wire bonding method thereof

Info

Publication number
JPS56110244A
JPS56110244A JP1249680A JP1249680A JPS56110244A JP S56110244 A JPS56110244 A JP S56110244A JP 1249680 A JP1249680 A JP 1249680A JP 1249680 A JP1249680 A JP 1249680A JP S56110244 A JPS56110244 A JP S56110244A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
pellet
wire bonding
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1249680A
Other languages
Japanese (ja)
Other versions
JPS6337498B2 (en
Inventor
Hajime Murakami
Shinji Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Iruma Electronic Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Hitachi Iruma Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd, Hitachi Iruma Electronic Co Ltd filed Critical Hitachi Ltd
Priority to JP1249680A priority Critical patent/JPS56110244A/en
Publication of JPS56110244A publication Critical patent/JPS56110244A/en
Publication of JPS6337498B2 publication Critical patent/JPS6337498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Abstract

PURPOSE:To make possible an automatic wire bonding by forming a position identification pad at least on two spots on the surface of a printed circuit board and correcting a position for the board and a pellet. CONSTITUTION:A concave is formed on a printed circuit board 10 and a pellet 13 is adhered in this concave 11. Around the concave 11, alead 12a for connecting a wire 15 with an electrode pad 14 is arranged. At least two spots near the lead 12a, a position identification pad 17 is formed. After a position detection device 21 consisting of a combination of TV camera 19 and a computer 20 worked to detect the relative position relationship between the pellet 1 and the board, the position relation is corrected according to the memory of the computer and then an automatic wire bonder 22 is actuated. In this manner, automatic operation is possible without the necessity of positioning through a visual check by an operator.
JP1249680A 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof Granted JPS56110244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Publications (2)

Publication Number Publication Date
JPS56110244A true JPS56110244A (en) 1981-09-01
JPS6337498B2 JPS6337498B2 (en) 1988-07-26

Family

ID=11806975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249680A Granted JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Country Status (1)

Country Link
JP (1) JPS56110244A (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140858A (en) * 1974-05-02 1975-11-12
JPS5140867A (en) * 1974-10-04 1976-04-06 Hitachi Ltd
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS5237768A (en) * 1975-09-19 1977-03-23 Seiko Instr & Electronics Ltd Substrate having positioning marks
JPS52127069A (en) * 1976-04-16 1977-10-25 Shinkawa Ltd Wire bonding apparatus
JPS5329068A (en) * 1976-08-31 1978-03-17 Sony Corp Automatic wire bonding unit
JPS5390863A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Wire bonding method and mark provided on subsutrate
JPS5450267A (en) * 1977-09-27 1979-04-20 Matsushita Electric Ind Co Ltd Automatic wire bonding method
JPS54150462U (en) * 1978-04-10 1979-10-19
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS5629357A (en) * 1979-08-18 1981-03-24 Mitsubishi Electric Corp Semiconductor container
JPS5737768A (en) * 1980-08-18 1982-03-02 Pioneer Electronic Corp Bookshelf type record player

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140858A (en) * 1974-05-02 1975-11-12
JPS5140867A (en) * 1974-10-04 1976-04-06 Hitachi Ltd
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS5237768A (en) * 1975-09-19 1977-03-23 Seiko Instr & Electronics Ltd Substrate having positioning marks
JPS52127069A (en) * 1976-04-16 1977-10-25 Shinkawa Ltd Wire bonding apparatus
JPS5329068A (en) * 1976-08-31 1978-03-17 Sony Corp Automatic wire bonding unit
JPS5390863A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Wire bonding method and mark provided on subsutrate
JPS5450267A (en) * 1977-09-27 1979-04-20 Matsushita Electric Ind Co Ltd Automatic wire bonding method
JPS54150462U (en) * 1978-04-10 1979-10-19
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS5629357A (en) * 1979-08-18 1981-03-24 Mitsubishi Electric Corp Semiconductor container
JPS5737768A (en) * 1980-08-18 1982-03-02 Pioneer Electronic Corp Bookshelf type record player

Also Published As

Publication number Publication date
JPS6337498B2 (en) 1988-07-26

Similar Documents

Publication Publication Date Title
MY105130A (en) Self-centering electrode for power devices.
SG73389A1 (en) Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method
EP0721209A3 (en) Method of testing semiconductor devices and conductive adhesive thereby used
JPS55118643A (en) Wire bonding process
JPS552735B1 (en)
CN210142645U (en) Packaging structure suitable for bidirectional TVS chip
JPS56110244A (en) Printed circuit board for semiconductor device and wire bonding method thereof
JPS5745263A (en) Package for semiconductor device
JPS5449066A (en) Semiconductor device
JPS574134A (en) Recognizing device
JPS57111054A (en) Semiconductor device
MY106858A (en) Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin.
JPS6344998Y2 (en)
JPS5615056A (en) Semiconductor device
JPS5378768A (en) Wire bonding method of semiconductor element
EP0376924A3 (en) Gold compression bonding
JPS54152469A (en) Manufacturing device for semiconductor device
JPS53145570A (en) Die bonding method of semiconductor device
JPS57148360A (en) Semiconductor device
JPS5290975A (en) Electronic wristwatch
JPS53141575A (en) Semiconductor device
JPS54137971A (en) Resin-sealed type semiconductor device
JPS5347275A (en) Assembling method of semiconductor device
JPS5874064A (en) Lead frame
JPS5427364A (en) Metal wire bonding method for semiconductor device