JPS574134A - Recognizing device - Google Patents

Recognizing device

Info

Publication number
JPS574134A
JPS574134A JP7823580A JP7823580A JPS574134A JP S574134 A JPS574134 A JP S574134A JP 7823580 A JP7823580 A JP 7823580A JP 7823580 A JP7823580 A JP 7823580A JP S574134 A JPS574134 A JP S574134A
Authority
JP
Japan
Prior art keywords
pattern
optical system
pad
pellet
recognized material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7823580A
Other languages
Japanese (ja)
Inventor
Masahito Nakajima
Tetsuo Hizuka
Yushi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7823580A priority Critical patent/JPS574134A/en
Priority to US06/272,368 priority patent/US4450579A/en
Priority to DE8181302575T priority patent/DE3175773D1/en
Priority to EP81302575A priority patent/EP0041870B1/en
Publication of JPS574134A publication Critical patent/JPS574134A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To clearly and highly accurately perform the detection of the pattern position for a recognized material by a method wherein an image pickup section, to be used for detecting the pattern position in the recognized material, is consisted of the first optical system to be used for the image pickup of the shape of the recognized material and the second optical system which will be used for image pikcup of the pattern in the recognized material. CONSTITUTION:A hydrid IC whereon an IC chip pellet 20 was placed is arranged on an XY stage 1. On this pellet 20, an IC chip pattern 21 and an IC pad pattern 22 are located, and then the second IC pad pattern 23 is formed on the pattern 21. In this constitution, two optical systems of A and B are provided in order to perform a image pickup for the pattern 21, and the pellet 20 containing the pattern 21 is placed in the visual range in the B optical system 2 and takes in the image information of the pattern 21. Also, in the A optical system 3, image information for the second IC pad pattern 23 is taken in and the position of the bonding pad is detected by cooperating the two optical systems of 2 and 3.
JP7823580A 1980-06-10 1980-06-10 Recognizing device Pending JPS574134A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7823580A JPS574134A (en) 1980-06-10 1980-06-10 Recognizing device
US06/272,368 US4450579A (en) 1980-06-10 1981-06-10 Recognition method and apparatus
DE8181302575T DE3175773D1 (en) 1980-06-10 1981-06-10 Pattern position recognition apparatus
EP81302575A EP0041870B1 (en) 1980-06-10 1981-06-10 Pattern position recognition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7823580A JPS574134A (en) 1980-06-10 1980-06-10 Recognizing device

Publications (1)

Publication Number Publication Date
JPS574134A true JPS574134A (en) 1982-01-09

Family

ID=13656372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7823580A Pending JPS574134A (en) 1980-06-10 1980-06-10 Recognizing device

Country Status (1)

Country Link
JP (1) JPS574134A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196377A (en) * 1981-05-27 1982-12-02 Hitachi Ltd Pattern recognizing method
JPS61161583A (en) * 1985-01-09 1986-07-22 Matsushita Electric Ind Co Ltd Pattern recognizing device
JPS61161582A (en) * 1985-01-09 1986-07-22 Matsushita Electric Ind Co Ltd Pattern recognizing device
JPS63167981A (en) * 1986-12-29 1988-07-12 Matsushita Electric Ind Co Ltd Pattern recognizing device
JPH0373451U (en) * 1984-02-22 1991-07-24

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196377A (en) * 1981-05-27 1982-12-02 Hitachi Ltd Pattern recognizing method
JPH0373451U (en) * 1984-02-22 1991-07-24
JPH0537476Y2 (en) * 1984-02-22 1993-09-22
JPS61161583A (en) * 1985-01-09 1986-07-22 Matsushita Electric Ind Co Ltd Pattern recognizing device
JPS61161582A (en) * 1985-01-09 1986-07-22 Matsushita Electric Ind Co Ltd Pattern recognizing device
JPS63167981A (en) * 1986-12-29 1988-07-12 Matsushita Electric Ind Co Ltd Pattern recognizing device

Similar Documents

Publication Publication Date Title
ES477151A1 (en) Recognition apparatus
EP0358512A3 (en) Position detecting method and apparatus
ATE69533T1 (en) IDENTIFICATION SYSTEM AND TRANSPONDER.
FR2497376B1 (en) METHOD AND DEVICE FOR MANUFACTURING IDENTIFICATION CARDS
JPS6465848A (en) Alignment
MY100275A (en) Lead frame and method
JPS574134A (en) Recognizing device
DE69121545D1 (en) Device for detecting defects on a moving material web
JPS52149070A (en) Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS54150088A (en) Test device for ic lead bend
JPS5355983A (en) Automatic micro defect detector
EP0186750A3 (en) Obstructed-field-indicia-sensing device
JPS574133A (en) Device for pattern image pickup
JPS5339156A (en) Pellet position detecting apparatus
JPS57198638A (en) Detection of wire bonding state and device therefore
FR2514157B1 (en) METHOD AND DEVICE FOR DETECTING THE FOCUSING OF A LENS
JPS55110377A (en) Optical character reader
JPS57181434A (en) Position detector for head in disc storage device
JPS57111781A (en) Pattern location detecting method
JPS5294038A (en) Optical character reading device
JPS5757383A (en) Handwriting detecting device
JPS56136280A (en) Groove location detecting method
JPS5436465A (en) Method and device for aural and visual route guiding
JPS5227697A (en) Personal identification method for test body
FR2653221B1 (en) METHOD FOR DETECTING THE RELATIVE POSITIONING OF A NEEDLE INDICATOR, AND ELECTRONIC DEVICE FOR IMPLEMENTING IT.