JPS574133A - Device for pattern image pickup - Google Patents

Device for pattern image pickup

Info

Publication number
JPS574133A
JPS574133A JP7823380A JP7823380A JPS574133A JP S574133 A JPS574133 A JP S574133A JP 7823380 A JP7823380 A JP 7823380A JP 7823380 A JP7823380 A JP 7823380A JP S574133 A JPS574133 A JP S574133A
Authority
JP
Japan
Prior art keywords
detecting circuit
image pickup
image
pattern
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7823380A
Other languages
Japanese (ja)
Inventor
Masahito Nakajima
Tetsuo Hizuka
Yushi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7823380A priority Critical patent/JPS574133A/en
Publication of JPS574133A publication Critical patent/JPS574133A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To obtain a clear picture frame even when chips are replaced by a method wherein the pattern image pickup device to be provided on an IC chip pellet is composed of a plurality of optical image pickup sections, the focus depth characteristic of which is differred by stages and also a device, with which the most clear height of focus depth is detected, is provided. CONSTITUTION:The pattern on the IC chip pellet 2, which is placed on a substrate 1, is image-formed on the surface 5 of an image pickup element 6 through the intermediary of an object lens 3 and a relay lens 4 located on the pattern image pickup device 10. In this constitution, a lens 4 is consisted of a group of lenses of nXm pieces having a slightly different focal distance respectively, and nXm pieces of patterns are image-formed on the element surface 5 also. Then, an image signal detecting circuit 11 to be used as a detecting system is provided, the image signal from this point is converted into a differential waveform and the image of the heghest level among the waveforms corresponded to the images of nXm pieces by a high level detecting circuit 13 is obtained by a frame detecting circuit 14. Subsequently, the address of the desired pad is detected using a pattern data detecting circuit 15 and a pattern position detecting circuit 16.
JP7823380A 1980-06-10 1980-06-10 Device for pattern image pickup Pending JPS574133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7823380A JPS574133A (en) 1980-06-10 1980-06-10 Device for pattern image pickup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7823380A JPS574133A (en) 1980-06-10 1980-06-10 Device for pattern image pickup

Publications (1)

Publication Number Publication Date
JPS574133A true JPS574133A (en) 1982-01-09

Family

ID=13656317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7823380A Pending JPS574133A (en) 1980-06-10 1980-06-10 Device for pattern image pickup

Country Status (1)

Country Link
JP (1) JPS574133A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078713A (en) * 2004-09-09 2006-03-23 Hitachi High-Tech Electronics Engineering Co Ltd Work identification information reading device and method
JP2009103499A (en) * 2007-10-22 2009-05-14 Meidensha Corp Abrasion amount measuring device of trolley wire
JP2012532356A (en) * 2009-07-06 2012-12-13 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング Optical module for focusing simultaneously on two visible ranges
US9335264B2 (en) 2010-11-30 2016-05-10 Conti Temic Microelectronic Gmbh Detection of raindrops on a pane by means of a camera and lighting
US10137842B2 (en) 2011-06-03 2018-11-27 Conti Temic Microelectronic Gmbh Camera system for a vehicle
KR20190045165A (en) 2016-08-29 2019-05-02 신에쓰 가가꾸 고교 가부시끼가이샤 Coating composition and coated article
JP2020108161A (en) * 2015-07-17 2020-07-09 ソイテックＳｏｉｔｅｃ Method for manufacturing substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078713A (en) * 2004-09-09 2006-03-23 Hitachi High-Tech Electronics Engineering Co Ltd Work identification information reading device and method
JP2009103499A (en) * 2007-10-22 2009-05-14 Meidensha Corp Abrasion amount measuring device of trolley wire
JP2012532356A (en) * 2009-07-06 2012-12-13 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング Optical module for focusing simultaneously on two visible ranges
US9040915B2 (en) 2009-07-06 2015-05-26 Conti Temic Microelectronic Gmbh Optical module for simultaneously focusing on two fields of view
US9335264B2 (en) 2010-11-30 2016-05-10 Conti Temic Microelectronic Gmbh Detection of raindrops on a pane by means of a camera and lighting
US10137842B2 (en) 2011-06-03 2018-11-27 Conti Temic Microelectronic Gmbh Camera system for a vehicle
JP2020108161A (en) * 2015-07-17 2020-07-09 ソイテックＳｏｉｔｅｃ Method for manufacturing substrate
US10943778B2 (en) 2015-07-17 2021-03-09 Soitec Method for manufacturing a substrate
US11837463B2 (en) 2015-07-17 2023-12-05 Soitec Method for manufacturing a substrate
KR20190045165A (en) 2016-08-29 2019-05-02 신에쓰 가가꾸 고교 가부시끼가이샤 Coating composition and coated article

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